Table of Contents
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Contents
Contents
1.
Precaution........................................................................................................................................ 1 − 1
1.1.
Safety Precautions ................................................................................................................... 1 − 1
1.2.
Servicing Precautions ............................................................................................................... 1 − 3
1.3.
Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
2.
Product Specification ......................................................................................................................... 2 − 1
2.1.
Product Feature ....................................................................................................................... 2 − 1
2.1.1.
MX-D830 Product Feature ............................................................................................ 2 − 1
2.1.2.
MX-D830D Product Feature.......................................................................................... 2 − 2
2.1.3.
MX-D850 Product Feature ............................................................................................ 2 − 3
2.1.4.
MX-D870 Product Feature ............................................................................................ 2 − 4
2.1.5.
MX-D870D Product Feature.......................................................................................... 2 − 5
2.2.
Specifications.......................................................................................................................... 2 − 6
2.3.
Specifications Analysis ............................................................................................................. 2 − 7
2.4.
Accessories ............................................................................................................................ 2 − 9
2.4.1.
Supplied Accessories ................................................................................................... 2 − 9
3.
Disassembly & Reassembly ................................................................................................................ 3 − 1
3.1.
Overall Disassembly Reassembly................................................................................................ 3 − 1
4.
Troubleshooting ................................................................................................................................ 4 − 1
4.1.
Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1.
No Power................................................................................................................... 4 − 2
4.1.2.
No Output .................................................................................................................. 4 − 4
4.2.
Measures to be taken when the Protection Circuit operates............................................................... 4 − 5
4.2.1.
Operation of Power Block Protection Circuit .................................................................... 4 − 5
4.2.2.
Check AMP in Power Protection .................................................................................... 4 − 6
4.3.
MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7
4.4.
Buyer-Region Code Setting Method ............................................................................................ 4 − 8
4.4.1.
The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8
5.
PCB Diagram ................................................................................................................................... 5 − 1
5.1.
Wiring Diagram....................................................................................................................... 5 − 1
5.2.
KEY PCB Top ........................................................................................................................ 5 − 2
5.3.
KEY PCB Bottom.................................................................................................................... 5 − 3
5.4.
VFD PCB Top......................................................................................................................... 5 − 4
5.4.1.
Pin Connection ........................................................................................................... 5 − 5
5.5.
VFD PCB Bottom.................................................................................................................... 5 − 6
5.6.
MAIN PCB Top ...................................................................................................................... 5 − 7
5.6.1.
Pin Connection ........................................................................................................... 5 − 8
5.6.2.
Test Point Wave Form .................................................................................................. 5 − 10
5.7.
MAIN PCB Bottom.................................................................................................................. 5 − 11
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