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BP IX729B
ILLUSTRATIONS
(cont'd)
Figure
Page
8-11. Simplified HP-IB Handshake
between
a Talker (Compu~r
Controller) and One
Listener Gmrier
Noise
Test Set)
8-24
8-12. Indicator
Board Assembly
component
Locations
* *
8.24
8-13. HP-IB Interconnect
Board Assembly
Component
Locations
8-25
6.14. Front Panel Key and Display Board
Assembly Component
Locations
.
8.25
S-15.
Microprocessor
Board Assembly
Component
Locations
.
8.21
8-16.
Data Input Circuit Schematic Diagram
8-27
S-17. HP-IB Interconnect
Board Assembly
Component
Locations
t 8.30
8"18. Microprocessor Board Assembly
Component
Locations
t
8.31
8-19. Data Processing Circuita
Schematic Diagram
8-31
8-20. Front Panel Key and Display Board
Assembly Component
Locations
*
8-34
8-21. Microprocessor Board Assembly
Component
Locations
8.35
8-22. Switch and LED Control Circuits
Schematic Diagram
8.35
8.23. Power Supply Board Assembly
Component
Locationa
837
8-24. Power Supply Circuits
Schematic Diagram
8.37
Contents
Figure
Page
APPENDIX
A
A-l. P/O Service Sheet 3 Phase Lock
Circuits Schematic Diagram
*, , *,
A.2
A.2. Overall Fusctional
Block Diagram
A-3
A-3. Reference Up-Conversion,
Test Signal
Down-Conversion
and Phase Detecting
Circuita Schematic Diagram
A-5
A-4. Low Pass Filter and Low Noise
Amplifier Schematic Diagram
A-7
A-5. Simplified BP-IB Handshake between
a Talker (Computer Controller) and One
Listener (Carrier Noise Test Set)
A-8
A-6. Microprocessor Board Assembly
Component Locations
A-9
A-7. Data Input Circuits
Schematic Diagram
A-9
A-8. Microprocessor Board Assembly
Component
Locations
A-13
A-9. Data Processing Circuits
Schematic Diagram
A-13
A-10. Microprocessor
IBoard Assembly
Component
Locations
A-17
A-11. Switch and LED Control Circuit6
Schematic Diagram
A-17
A-12. Power Supply Circuits
Schematic Diagram
A-19
APPENDIX
0
D-1. Typical Phase Lock Loop Filter
Transfer Characteristic
D-2
TABLES
Table
Page
1.1.
1-2.
1-3.
l"4.
1.5.
3-l.
3-2.
4-l.
4-2.
5-l.
5-2.
Specifications
.............................
1-4
Supplemental
Characteristics
..............
1-6
system Specificationa
l-7
Recommended Test Equipment
.............
l-9
Recommended Alternate
Test Equipment
........................
l-11
Allowable HP-IB Address Codes ...........
2-3
IF
Output Check ...........................
3.9
Status Bite and Their Decimal Equivalenta
for Two Phase Lock Conditions
.........
3-12
HP-IB Message Reference Table ...........
3-26
HP-IB Program Codes ....................
3-28
Allowable HP-IB Address Codes ..........
3.29
IF output
Level
...........................
4.3
Performance Test Record .................
4.18
Factory Selected Componenta
..............
6-l
Phase Lock and Unlock Status Bits ........
5-l
Table
Page
5-3.
6.1.
6-2.
6-8.
7~1.
&l.
3-2.
8.3.
8-4.
8-5.
8-6.
8-7.
Definition
of Option Switch Sl .............
6-8
Reference Designations
and
Abbreviations
...........................
6-3
Replaceable Parts
.........................
6-5
Code List of Manufacturers
...............
6-34
Manual Changes by Serial Number
........
7-1
Etched Circuit Soldering Equipment
.......
8-2
Schematic Diagram Notes
.................
S-3
Signatures for Verifying
Address Decoding
....................
;. 8-24
Signatures for Verifying
Microprocessor
and Input/Output
Operation
............
8-24
Signatures for Verifying
Address Decoding
......................
8-28
Signatures for Verifying
ROM Operation
and Data Stored in ROM ................
8-28
Signatures for Verifying
Microprocessor,
ROM, RAM
and
Data I3uffer
Operation
..............
8-29
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