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HCD-HPX10W
7-4. PRINTED WIRING BOARD — CD BOARD —
1
2
3
A
CD BOARD
(COMPONENT SIDE)
B
C302
C303
C305
C
R313
C315
C316
D
C314
C312
C318
E
C184
C210
R162
C183
R165
F
C182
R201
C201
R171
C203
G
C209
X171
C151
H
I
HCD-HPX10W
• See page 57 for Circuit Boards Location.
4
5
6
C255
R351
C257
R405
R352
R302
R353
R354
C258
C259
C308
R191
R173
C14
C174
C172
C196
R172
C10
C195
C171
C11
C15
C16
C125
Q10
E
R121
C134
C123
:Uses unleaded solder.
7
8
9
CD BOARD
(CONDUCTOR SIDE)
C252
28
22
21
C260
IC251
1
7
8
R253
C116
R252
TP
(VC)
C112
C111
C17
12
1-860-502-
(12)
CN101
62
62
10
11
12
M
M101
(SPINDLE)
3
1
4
5
S101
(LIMIT)
15
R404
R419
C306
C313
16
1
17
64
IC301
C320
R307
14
C311
C307
32
49
33
48
C309
R303
C310
R409
C212
R407
C211
R163
C163
C194
120
91
1
90
C181
C115
TP
IC101
(FE)
C162
R112
R111
30
61
31
60
C124
C122
C143
R203
TP
(RFACO)
R142
C141
R133
C142
OPTICAL
PICK-UP
BLOCK
(KSM-215DCP)
13
14
15
IC303
R403
M102
M
(SLED)
R301
R306
C317
R305
R402
1
R401
R410
R406
A
R412
R182
MAIN
BOARD
CN304
(Page 66)
C186
C185
R181
R161
27
C161
R204
12
1-860-502-
(12)
• Semiconductor
Location
Ref. No.
Location
IC101
F-12
IC251
D-9
IC301
D-12
IC303
B-13
Q10
H-6
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