Ebyte E22-230T22D User Manual page 21

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and other parts with large electromagnetic interference;
 High-frequency digital traces, high-frequency analog traces, and power traces must avoid the underside of
the module. If it is necessary to pass under the module, assuming that the module is soldered on the Top
Layer, ground copper (all copper) is placed on the Top Layer of the contact part of the module. And well
grounded), it must be close to the digital part of the module and routed on the Bottom Layer;

Assuming that the module is soldered or placed on the Top Layer, it is also wrong to arbitrarily route wires
on the Bottom Layer or other layers, which will affect the stray and receiving sensitivity of the module
to varying degrees；

Assuming that there are devices with large electromagnetic interference around the module, it will greatly
affect the performance of the module. It is recommended to stay away from the module according to the intensity
of the interference. If the situation allows, appropriate isolation and shielding can be done.；

Assuming that there are traces with large electromagnetic interference around the module (high-frequency
digital, high-frequency analog, power traces), the performance of the module will also be greatly affected.
It is recommended to stay away from the module according to the intensity of the interference. Proper isolation
and shielding;
 If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended,
there is still a risk of damage);
 The antenna installation structure has a great influence on the performance of the module, and it is necessary
to ensure that the antenna is exposed and preferably vertically upward;

When the module is installed inside the case, a high-quality antenna extension cable can be used to extend
the antenna to the outside of the case；

The antenna must not be installed inside the metal shell, which will greatly reduce the transmission distance.
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E22-230T22D User Manual