Rear Cover Bump - Lenovo 12B800DDGE Hardware Maintenance Manual

• Remove the system board shielding. See "System board shielding" on page 54.
• Remove the M.2 solid-state drive and thermal pad. See "M.2 solid-state drive and thermal pad" on page
55.
• Remove the Wi-Fi card. See "Wi-Fi card" on page 57.
• Remove the memory module and thermal pad. See "Memory module and shielding" on page 58.
• Remove the heat sink and gaskets. See "Heat sink and gaskets" on page 60.
• Remove the system board. See "System board" on page 63.
• Remove the optical drive housing. See "Optical drive housing" on page 65.
• Remove the 2.5-inch hard disk drive. See "2.5-inch hard disk drive" on page 66.
• Remove the optical drive, bracket and bezel. See "Optical drive, bracket and bezel" on page 68.
Removal steps

Rear cover bump

Prerequisite
Before you start, read Generic Safety and Compliance Notices, and print the following instructions.
Before you open the computer cover, turn off the computer and wait several minutes until the computer is
cool.
For access, remove the following parts in order:
• Remove the computer stand. See "Computer stand" on page 49.
• Remove the rear cover. See "Rear cover" on page 52.
• Remove the USB board. See "USB board" on page 53.
• Remove the system board shielding. See "System board shielding" on page 54.
• Remove the M.2 solid-state drive and thermal pad. See "M.2 solid-state drive and thermal pad" on page
55.
• Remove the Wi-Fi card. See "Wi-Fi card" on page 57.
• Remove the memory module and thermal pad. See "Memory module and shielding" on page 58.
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