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Item Description
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screw driver for T10
Description #1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Remove power and fan tray by release screw and pull the latch down then pull out.
2.
Remove the screws in cover with screwdriver Phillips #1
3.
Remove the screws in bridge board with screwdriver Phillips #1
4.
Remove the screws in air baffle with screwdriver Phillips #1 and release cable connector.
5.
Remove front panel and tray
6.
Remove LED board and button
7.
Remove the screws in IF board with screwdriver Phillips #1 and then take out the PCBA.
8.
Remove the screws of air baffle in main board and eUSB with screwdriver Phillips #1 and then take out. And
remove the
battery.
9.
Remove the screws in main board with screwdriver Phillips #1 and then take out the PCBA.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Page 2
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Tool Size (if
applicable)
MF877-01
Quantity
of items
included
in product
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