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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Torx Driver
Torx Driver
Torx Driver
Phillips Driver
Phillips Driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
System Megacell -- Remove the top cover and locate the megacell on the system board. Remove the megacell and
dispose properly.
2.
Capacitors> 2.5CM -- Remove the power supplys from the system. With #2 Phillips driver remove the screws securing
the top cover and the heatsinks in the power sullpy then locate the capacitors and pry from the PCB and dispose of
properly.
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment #1 Location of Megacell
Attachment #2 ~#8 Capacitor location by model number of power supply
Attachment #1
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
T10
T15
T20
No.1
#2
Page 2
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