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Customer Care Europe, Middle East & Africa
SCCE Training Group
-PCB handling & cleaning
To avoid damages of PCB and/or components through electrostatic discharging, handle the module in
ESD-suitable cases only.
Outside an ESD-bag always wear ESD-bracelets, which must be connected to earth bonding point.
A damage caused by electrostatic discharge does not produce a directly apparent fault, but it will appear (however)
within shortest time.
For cleaning use appropriate materials only. Do not use scratching or rubbing tools.
Usefull tools for cleaning are fluxcleaners such as "Kontakt LR" or "Electrolube FLU" in connection with ionized
compressed air.
For shield disassembling or any other work on the PCB it is very important to place the PCB into the rework jig JBT-13U
(NMP-code 0770242) to prevent damaging the LEDs – the pads the LEDs are connected with to the PCB are torn off by
applying only little pressure onto the PCB!!!
-Component charactaristics
Some components contain important data as tuning values or security data.
Therefore several steps described are only feasible if you are able to reflash/ realign the phone and/or rewrite
IMEI/SIMlock in certain cases. Please pay attention to separate notes.
-Shieldings, screw torques
To avoid RF-problems it is not allowed to reuse any shielding that once has been removed from shielding frame.
Always use new shieldings after successful repair!
To tighten screws only use a torque screwdriver with a torque adjusted to 17Ncm. Notice tightening order that is
shown in the picture below!
-Realign after repair
Characteristics of replacement may vary.
To prevent additional faults after repair (low standby,, losing network etc.) it is necessary to retune phone values
after repair, but never try to cover up a fault by justing the phone settings!
© NMP 2003
CONFIDENTIAL
NPE-4 6310/NPL-1 6310i
Date 22.04.2003
Checked by:
SCCE Training Group
3 (29)
Repair Hints
Version 3.0 Approved
Approved by:
SCCE
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