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KLV-26,32 NX400(S/B), 26,32 NX400(S/B)/S, 32,40 NX500
1-5. Lead Free Information
The circuit boards used in these models have been processed
using Lead Free Solder. The boards are identified by the LF
logo located close to the board designation.
Figure 2: LF logo
The servicing of these boards requires special precautions. It
is strongly recommended to use Lead Free Solder material in
order to guarantee optimal quality of new solder joints. Lead
Free Solder is available under the following part numbers:-
P
a
t r
n
u
m
b
r e
7
6 -
4
0
0 -
0
5
1 -
9
7
6 -
4
0
0 -
0
5
2 -
0
7
6 -
4
0
0 -
0
5
2 -
1
7
6 -
4
0
0 -
0
5
2 -
2
7
6 -
4
0
0 -
0
5
2 -
3
7
6 -
4
0
0 -
0
5
2 -
4
7
6 -
4
0
0 -
0
5
2 -
5
7
6 -
4
0
0 -
0
5
2 -
6
Due to high melting point of Lead Free Solder, the soldering
iron tip temperature needs to be set to 370 degrees
centigrade. This requires soldering equipment capable of
accurate temperature control coupled with a good heat
recovery characteristics.
For more information on the use of Lead Free Solder,
please refer to http://www.sony-training.com
Figure 3: LF logo on circuit board
D
a i
m
t e
r e
R
e
m
a
k r
s
0
3 .
mm
0
2 .
5
Kg
0
4 .
m
m
0
5 .
0
Kg
0
5 .
m
m
0
5 .
0
Kg
m
0
6 .
m
0
2 .
5
Kg
0
8 .
m
m
1
0 .
0
Kg
1
0 .
m
m
1
0 .
0
Kg
1
2 .
m
m
1
0 .
0
Kg
1
6 .
m
m
1
0 .
0
Kg
RM-GA018
– 4 –
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