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HP HP417 Product End-Of-Life Disassembly Instructions

Unified wired-wlan appliance

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP417 Unified Wired-WLAN Appliance(JG971A_9801A0NA,JG972A_9801A0NB)
HP417 Unifd Wrd-WLAN TAA Applnc(JG973A_9801A0NC,JG974A_9801A0ND)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Screw Self-Tapping P2*7mm(
Assy
Standoff M2*(10.05+5.00)mm (
) in Assy
Screw Machine P2*6.5mm in Assy
NUT M2*4*1.6mm in Assy
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Unscrew&Remove 4 screws "Self-Tapping" from Top&Bottom HP417 housing.
3. Unscrew&Remove 2 screws "Self-Tapping" from HP417 Doughter PCBA and Botteom housing.
4. Unscrew&Remove 2 screws "Machine P2*6.5mm" from HP417 Doughter PCBA and Botteom housing.
5. Unscrew&Remove 2 screws "Standoff M2" from HP417 Main PCBA.
6. Unscrew&Remove 2 screws "NUT M2*4" from HP417 Main PCBA.
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
Main Board &Daughter Board.
Screw Self-Tapping P2*7mm For WP333 鍍鎳 (
) in
十字自攻牙螺絲
昶輝)
Standoff M2*(10.05+5.00)mm For WP338 鍍 鎳
M2 的机械牙十字螺
(昶輝)
Screw Machine P2*6.5mm For WP338 鍍鎳 ( 昶
輝)
NUT M2*4*1.6mm For WP338 鍍鎳(昶輝)
Quantity
of items
included
in
product
2
6
2
Tool Size (if
applicable)
1#
Page 1

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Summary of Contents for HP HP417

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations) Figure 1. Remove the mounting angle EL-MF877-00 Page 2 Template Revision B...
  • Page 3 Figure 2. Remove Bottom cover 3 Figure 3. Treatments to STANDOFF and PCB 6 EL-MF877-00 Page 3 Template Revision B...
  • Page 4 3.4 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Clear the黑膠& Adhesive tape, if had, in PCBA and housing. EL-MF877-00 Page 4 Template Revision B...
  • Page 5 3.5 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations) 4.0 Revised record Date Version Author Modify content 2014.10.27 Bo.Chen/Eddie Initial version...

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