HP J9405B Product End-Of-Life Disassembly Instructions page 2

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
pliers.
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take out plastic mat and screw.
2. Take out plastic case.
3. Take out EMI Shielding case.
4. Take out mylar film.
6. Take out mix wire.
7. Take out heatsink.
8. Take out copper.
9. Take out socket.
10. Take out solder.
11. Take out inductors.
12. Take out transformer.
13. Take out big capacitor.
14. Left PCBA.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision A
Tool Size (if
applicable)
Page 2