HP 5900AF-48XG-4QSFP+ Product End-Of-Life Disassembly Instructions page 2

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws on fan-assembly 3, and then remove fan-assembly 3.
4. Remove the power 4.
5. Remove the filler panel 5.
6. Unscrew the screws on top cover 6, and remove top cover 6.
7. Unscrew the screws on front panel 7, and then remove front panel 7.
8. Unscrew the screws on PCB 9, and remove PCB 9.
9. Unscrew the screws on PCB 10, and remove PCB 10.
10. Unscrew the screws on shielding plate 11, and remove shielding plate 11.
11. Unscrew the screws on wind cover 12, and then remove wind cover 12.
12. Unscrew the screws on PCB 13, and remove PCB 13.
13. Remove all of the labels.
14. Unscrew the screws on 3-2, and then remove 3-2.
15. Unscrew the screws on 3-3, and then remove 3-3.
16. Unscrew the screws on fan 3-4, and then remove fan 3-4.
17. Unscrew the screws on pcb 3-5, and then remove 3-5.
18. Unscrew the screws on pulled handle 3-6, and then remove pulled handle 3-6.
19. Remove shielding finger 3-7.
20. Remove all of the labels.
21. Unscrew the screws on pulled handle 5-1, and then remove pulled handle 5-1.
22. Remove shielding finger 5-3.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
Tool Size (if
applicable)
2#
Page 2