Placement - Fibocom GTS-4E-00 Hardware Integration Manual

increase the volume outside of the module by defining the dimensions of the paste mask to form a
T-shape (or equivalent) extending beyond the Copper mask as shown in Figure 5. The solder paste
should have a total thickness of 175 to 200 μm.
Figure 5： Recommendations for copper, solder and paste masks with enlargement
Note:
1. The paste mask outline needs to be considered when defining the minimal distance to the next
component.
2. The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to
the specific production processes (e.g. soldering etc.) of the customer.
5.2

Placement

A very important factor in achieving maximum GPS performance is the placement of the receiver on the
PCB. The connection to the antenna must be as short as possible to avoid jamming into the very
sensitive RF section.
Make sure that RF critical circuits are clearly separated from any other digital circuits on the system
GTS-4E GPS Module Hardware Integration Manual Page 16 of 22