Ebyte MBL Series User Manual

Ebyte MBL Series User Manual

Testing kit new generation package compatible sub-1g wireless module
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MBL Series Testing Kit User Manual
New Generation Package Compatible
Sub-1G Wireless Module
E07-900MBL-01

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Summary of Contents for Ebyte MBL Series

  • Page 1 MBL Series Testing Kit User Manual New Generation Package Compatible Sub-1G Wireless Module E07-900MBL-01...
  • Page 2: Table Of Contents

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 Contents I. Product Overview ..........................3 1.1 Product Introduction ......................... 3 1.2 Dimensions, interface description .....................4 1.3 Support List ..........................5 II. Software Introduction ........................6 2.1 Directory structure ........................6 2.2 IAR Engineering ........................7 2.3 Main function ..........................8 2.4 Transceiver Timing ........................
  • Page 3 This document does not hereby grant, by estoppel or otherwise, any license, express or implied, to any intellectual property rights. The test data obtained in this article are all obtained by the Ebyte laboratory test, and the actual results may be slightly different.
  • Page 4: Product Overview

    I. Product Overview 1.1 Product Introduction MBL series testing kits are designed to help users quickly evaluate Ebyte's new generation of package-compatible wireless modules. Most of the pins on the board have been led out to pin headers on both sides, and developers can easily connect various peripheral devices through jumpers according to actual needs.
  • Page 5 成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 Definition Function Description Module power supply pin. It needs to be shorted with pin 2 to supply power to the module. 3.3V 3.3V power pin 3.3V 3.3V power pin MCU power supply pin. It needs to be shorted with pin 3 to power the MCU.
  • Page 6: Support List

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 1.3 Support List Chip solution Manufacturer Module model CC1101 Texas Instruments E07-400M10S CC1101 Texas Instruments E07-900M10S SI4438 Silicon Labs E30-400M20S SI4463 Silicon Labs E30-900M20S LLCC68 Semtech E220-400M22S LLCC68 Semtech E220-900M22S SX1278 Semtech E32-400M20S SX1276 Semtech E32-900M20S SX1268 Semtech E22-400M22S SX1262...
  • Page 7: Software Introduction

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 II. Software Introduction 2.1 Directory structure Item Description File You can download the sample file from the official website, and open the Directory directory as shown in the figure below. Catalog You can use the IAR For STM8 development environment to find the entry description file and open the project.
  • Page 8: Iar Engineering

    When switching the workspace, different macro definitions will be used to switch the driver files of different modules. When the "Exclude from build" attribute of "Drivers/Ebyte/RF" is changed, the target module driver folder is selected to participate in the compilation process.
  • Page 9: Main Function

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 2.3 Main function main.c is the main function entry. The demo function process is simplified as follows: Item Description Key Function When a button is pressed, the command data is sent wirelessly. Essentially sending a specific string "ping" and expecting a "pong" in response.
  • Page 10 成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 replace it with the same type of function Go_xxxxx(). Sending mode When calling the sending function, the underlying driver actually switches the module into standby mode first, and usually completes the modulation parameter configuration in this mode, such as frequency, power, frequency offset, etc.
  • Page 11: Programming

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 Programming Description Document ebyte_core.h A module structure is defined, the basic functions are abstracted, and the functions of the underlying module will be bound to the structure. When used in simple sending and receiving applications, there is no need to understand the underlying working details of each module, and the data can be sent and received by directly calling the abstracted function.
  • Page 12 成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 underlying modules, you can also directly remove the ebyte_core.c/h file, and there is no strong coupling between the layers. ebyte_exx.c It is a specific module driver file, which is generally packaged and does not need to be modified by the user. It only needs to consider how to input and output data from this "box".
  • Page 13 成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 situations. ebyte_exx.h Some conventional modulation parameters are defined, generally do not need to be modified, you can adjust them by yourself. Note, please understand the instructions in the comments when modifying. There is a range check for parameters in the module driver, and wrong modulation parameters will cause initialization failure.
  • Page 14: Quick Demo

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 III. Quick Demo 3.1 Signal line connection Item Description Power jumper cap Mode selection jumper cap Auxiliary USB cable, antenna, PC, etc. Copyright ©2012–2021,成都亿佰特电子科技有限公司...
  • Page 15: Serial Assistant

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 Serial Assistant Item Description Device manager View the serial port number Serial software Example of push #RECV Identifier, used only for prompting, indicates the data received button by the wireless module. communication #SEND identifier, only used for prompting, indicating the data sent by the wireless module.
  • Page 16: Faq

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 IV. FAQ 4.1 The transmission distance is not ideal.  When there is a straight-line communication obstacle, the communication distance will be attenuated accordingly;  Temperature, humidity, and co-channel interference will increase the communication packet loss rate; ...
  • Page 17: The Bit Error Rate Is Too High

    成都亿佰特电子科技有限公司 MBL 评估套套件用户手册 4.3 BER is too high There is co-channel signal interference nearby, stay away from the source of interference or modify the  frequency and channel to avoid interference; Unsatisfactory power supply may also cause garbled characters, so ensure the reliability of the power supply; ...

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