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Chengdu Ebyte Electronic
25°C.
When soldered components need to be re-profiled, they should be reflowed with a carrier fixture of the same
construction, or verified to have an equivalent thermal load.
The reflow profiles in this document are some suggestions for soldering only Ebyte modules, and cannot be
used to confirm the actual assembly profile of the user. The actual production process of the user should be based
on the specific production process, needs and circuit board design to develop the actual production assembly curve,
and should not exceed the parameters in the table below.
Reflow Profile Characteristics
Preheat/Keep Warm
Heating slope（TL~Tp）
liquidus temperature（TL）
Hold time above TL
Package body peak temperature Tp
Time (Tp) within 5°C of the specified
grading temperature (Tc), see the figure
below
cooling slope（Tp~TL）
Time from room temperature to peak
temperature
※The peak temperature (Tp) tolerance definition of the temperature profile is the upper limit of the user
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Technology Co., Ltd
lowest temperature
（Tsmin）
maximum temperature
（TSMDx）
time（Tsmin~Tsmin）
Technology Co., Ltd
Leaded process assembly
100℃
150℃
60-120 seconds
3°C/sec, max
183℃
60~90 seconds
The
user
cannot
exceed
temperature
indicated
product's "Moisture Sensitivity"
label
20 seconds
6°C/sec, max
6 minutes, maximum
E83-2G4M03S User Manual
Lead-free process assembly
150℃
200℃
60-120 seconds
3°C/sec, max
217℃
60~90 seconds
the
The
user
cannot
on
the
temperature
indicated
product's "Moisture Sensitivity"
label
30 seconds
6°C/sec, max
8 minutes, maximum
exceed
the
on
the
9
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