Page 1 Instruction Manual ® AURIGA Compact Crossbeam workstation ®...
Page 2 Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be copied or otherwise duplicated, even for the customer’s internal needs apart from a single back-up copy for safety purposes.
Page 3: Table Of Contents
`çåíÉåíë Table of contents 1. About this manual ..................7 1.1. Safety instructions in this manual ..............8 1.2. Typographical conventions ................9 1.3. Definition of terms ..................10 2. Safety ......................11 2.1. Intended use ....................11 2.2. Prevention of accidents and of improper use ..........13 2.3.
Page 4 `çåíÉåíë 3.4. Principle of operation ..................32 3.4.1. Vacuum system ..................... 32 3.4.2. Specimen stage ..................... 33 ® 3.4.3. Electron optics (GEMINI column) ................ 34 3.4.4. Ion optics (FIB column) ..................36 3.4.4.1. Imaging modes......................38 3.4.5. Signal detection ..................... 39 3.4.5.1.
Page 5 `çåíÉåíë 6.4.2. Setting detection parameters ................82 6.4.2.1. Selecting a detector....................... 82 6.4.2.2. Using the SE2 detector ....................83 6.5. Electron beam deposition or etching (with GIS upgrade only) ....83 6.5.1. Heating the reservoirs ................... 84 6.5.2. Depositing or etching with the electron beam ............85 ®...
Page 6 `çåíÉåíë 6.9. Switching off the workstation as a matter of routine ........130 6.9.1. Changing to STANDBY mode ................130 6.9.2. Changing to OFF mode ..................131 6.10. Switching off in an emergency ..............132 6.10.1. Switching on again after an emergency off ............132 6.11.
Page 7: About This Manual
This instruction manual is designed for users who have been trained to operate the workstation by an authorised Carl Zeiss expert. Operators of the workstation must not deviate from the instruc- tions provided in this document.
Page 8: Safety Instructions In This Manual
NK=^Äçìí=íÜáë=ã~åì~ä p~ÑÉíó=áåëíêìÅíáçåë=áå=íÜáë=ã~åì~ä 1.1. Safety instructions in this manual The safety instructions in this manual follow a system of risk levels, that are defined as follows: DANGER This safety symbol and signal word indicates an imminently hazardous situation. Disregarding this warning WILL result in death or serious injury. WARNING This safety symbol and signal word indicates a potentially hazardous situation.
Page 9: Typographical Conventions
NK=^Äçìí=íÜáë=ã~åì~ä qóéçÖê~éÜáÅ~ä=ÅçåîÉåíáçåë 1.2. Typographical conventions For the description of software, the following typographical conventions are used: Typography Meaning Push <ENTER>. Push the ENTER key on the keyboard. Type <key1, key2> Type key 1 first, then type key 2 on the keyboard. Type <Ctrl + Alt + Del>.
Page 10: Definition Of Terms
Electrically skilled person who has been trained to perform basic main- tenance tasks User A person or organisation that uses products of Carl Zeiss. Carl Zeiss service engineer, Specially trained service expert, either Carl Zeiss staff or authorised Carl Zeiss service staff service partner of Carl Zeiss.
Page 11: Safety
OK=p~ÑÉíó fåíÉåÇÉÇ=ìëÉ 2. Safety 2.1. Intended use ® ® AURIGA Compact is a CrossBeam workstation that allows microscopic examination and mod- ification of suitable specimens. The workstation allows you to perform the full range of ® FESEM and CrossBeam applications, which are: •...
Page 12 OK=p~ÑÉíó fåíÉåÇÉÇ=ìëÉ If the workstation is equipped with a gas injection system (GIS), up to five different precursors out Gas injection system of the following can be available: Reactive product Precursor Used for Tungsten W(CO) deposition Tungsten hexacarbonyl Platinum deposition Methylcyclopentadienyl(trimethyl)platinum (IV) Silicon dioxide deposition...
Page 13: Prevention Of Accidents And Of Improper Use
You will find the user documentation in the document folder. Within the scope of initial start-up the Carl Zeiss service staff will perform a basic operator training. Operator training The basic operator training consists of fundamental operation procedures including safety instruc- tions.
Page 14: Safety Summary
Service tasks DANGER Danger to life: Hazardous voltage inside the workstation. Only service engineers trained and authorised by Carl Zeiss are allowed to service the workstation. X-rays are produced within the workstation during operation. This is unavoidable since accelerat- Radiation protection ed electrons hit material thus generating radiation.
Page 15 OK=p~ÑÉíó p~ÑÉíó=ëìãã~êó Electrical connections CAUTION High leakage current Ensure proper grounding. Do not operate the workstation without separate ground connection. Gaseous dry nitrogen is used to ventilate the specimen chamber during specimen exchange. Gases Compressed air is used to operate several valves and the auto levelling system. WARNING Risk of poisoning: When working with certain specimens, poisonous or toxic substances will be deposited in the vacuum system.
Page 16 Gases can cause irritation to eyes, skin, and respiratory system. Do not remove a reservoir from the workstation. Contact the Carl Zeiss service to have an empty reservoir replaced. Never try to open a reservoir. During operation, unknown reaction products may be generated, when specimen material, reac- tive precursor products, electron beam and/or ion beam get in contact.
Page 17: Hazards Not Related To Personal Injury
Always move specimen stage to long working distance before opening the chamber door. CAUTION Risk of property damage Connect Carl Zeiss approved equipment only. Ensure the total load connected to the workstation does not exceed 10 A. IMPORTANT Fingerprints can cause virtual vacuum leaks.
Page 18: Safety Equipment
OK=p~ÑÉíó p~ÑÉíó=ÉèìáéãÉåí 2.4. Safety equipment 2.4.1. Safety devices In order to prevent any risk of hazard to human health or of property damage, the workstation is equipped with several safety and protective devices. 2.4.1.1. Protective cover panels Plinth, electron optical column and specimen chamber are secured with protective cover panels. WARNING Hazardous voltage inside the workstation.
Page 19: On/Off Switch
OK=p~ÑÉíó p~ÑÉíó=ÉèìáéãÉåí Vacuum interlock The vacuum interlock is an internal interlock. It ensures that Gun vacuum and System vacuum are better than the required thresholds. If this interlock is activated gun respectively EHT cannot be switched on. 2.4.1.3. ON/OFF switch The ON/OFF SWITCH is located at the rear of the plinth.
Page 20: Emo Button
OK=p~ÑÉíó p~ÑÉíó=ÉèìáéãÉåí 2.4.1.5. EMO button The emergency off button (EMO button) is located on the plinth. The EMO button is to be pressed in an emergency to cut off power to all devices connected to the EMO box. It must always be readily accessible and operable. 2.4.1.6.
Page 21: Safety Labels And Labels
OK=p~ÑÉíó p~ÑÉíó=ÉèìáéãÉåí 2.4.2. Safety labels and labels Appropriate safety labels on the workstation warn users of possible hazards. Each safety label is affixed close to the point where a particular hazard exists. Moreover, you will find several labels which provide legal information. 2.4.2.1.
Page 22: At The Rear Of The Workstation
Safety information CAUTION Radiation hazard X-rays are generated inside the electron microscope during operation. Do not remove any parts. Use genuine Carl Zeiss parts exclusively. Observe local safety and X-ray protection regulations. Legal information Safety information CAUTION High leakage current Ensure proper grounding.
Page 23: At The Rear Of The Electron Optical Column
2.4.2.4. Inside the workstation Underneath the cover panels of workstation there are some more safety labels, which are ad- dressed to authorised Carl Zeiss service engineers. These safety labels are described in the doc- uments for Carl Zeiss service staff.
Page 24: Safety Instructions For Handling Precursors (With Gis Upgrade Only)
High concentrations may cause central nervous disorders. Do not remove a reservoir from the workstation. Contact the Carl Zeiss service to have the empty reservoir replaced. Never try to open a reservoir. For more information refer to the instruction manual of the GIS and the Material Safety Data Sheets (MSDS).
Page 25: Description
PK=aÉëÅêáéíáçå lîÉêîáÉï 3. Description 3.1. Overview ® AURIGA Compact is a Crossbeam workstation. The basic workstation consists of a field emis- ® sion scanning electron microscope with GEMINI column and CANION FIB column. The following upgrade stages are possible: Upgrades Possible applications Charge compensation (CC)
Page 26: Workstation
PK=aÉëÅêáéíáçå tçêâëí~íáçå 3.2. Workstation Specimen chamber Control panel (optional) FIB column Personal computer (PC) ® Electron optical column, GEMINI column Dual joystick Detector 10 ON/OFF/STANDBY button Airlock (optional) 11 Plinth Monitors ® Fig. 3.1: View of AURIGA Compact workstation with several upgrades OS=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 27: Gas Injection System (Gis) Upgrade
PK=aÉëÅêáéíáçå tçêâëí~íáçå 3.2.1. Gas injection system (GIS) upgrade A gas injection system allows the injection of one or more process gases to the specimen surface. 3.2.1.1. Multi GIS The Multi GIS allows you to inject up to five different precursor gases. For details refer to the respective Instruction Manual.
Page 28: Charge Compensation Upgrade
PK=aÉëÅêáéíáçå tçêâëí~íáçå 3.2.2. Charge compensation upgrade Charge compensation is a method to inhibit charging of non-conducting specimens by injecting a local flow of gaseous nitrogen onto the area of interest. 3.2.2.1. Charge Compensator The Charge Compensator inhibits charging of non-conducting specimens by emitting a local flow of gaseous nitrogen onto the area of interest.
Page 29: Control Elements
PK=aÉëÅêáéíáçå `çåíêçä=ÉäÉãÉåíë 3.3. Control elements ® 3.3.1. SmartSEM user interface ® The workstation is controlled by the SmartSEM software. The software is operated via a graph- ical user interface. FIB toolbar FIB mode selection caption bar icon menu bar toolbar panel configuration bar data zone annotation bar...
Page 30: Dual Joystick
PK=aÉëÅêáéíáçå `çåíêçä=ÉäÉãÉåíë 3.3.2. Dual joystick The dual joystick is used for stage control and specimen navigation. The big joystick on the right is used to drive X- and Y-axis. The stage rotation is con- trolled by turning the upper knob to the left or to the right.
Page 31: Optional Control Panel
PK=aÉëÅêáéíáçå `çåíêçä=ÉäÉãÉåíë 3.3.3. Optional control panel The control panel is optionally available. It integrates a full sized keyboard and allows direct ac- cess to the most frequently used functions on the workstation. The following functions are available through: Encoders Push buttons •...
Page 32: Principle Of Operation
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4. Principle of operation 3.4.1. Vacuum system For operation of the workstation, gun head (10), column and specimen chamber have to be evac- uated. The vacuum is essential to operate the gun and to prevent collision of electrons and/or ions with gas molecules.
Page 33: Specimen Stage
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå In the gun head is a ultra high vacuum, which is maintained by two ion getter pumps (2). Gun vacuum The vacuum in the gun head is called ’Gun vacuum’. It should be well below 1 x 10 mbar.
Page 34: Electron Optics (Gemini ® Column)
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå ® 3.4.3. Electron optics (GEMINI column) ® The patented GEMINI column is the area of the FESEM, where electrons are emitted, acceler- ® ated, bundled, focused, and deflected. Main characteristics of the GEMINI optics are the so- called beam booster and an objective lens that consists of a combined electrostatic/electromag- netic lens doublet.
Page 35 PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå The emitted electrons are accelerated by the acceleration voltage (U The beam booster (U , booster voltage), which is always at a high potential when the acceleration voltage is at most 20 kV, is integrated directly after the anode. This guarantees that the energy of the electrons in the entire beam path is always much higher than the set acceleration voltage.
Page 36: Ion Optics (Fib Column)
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.4. Ion optics (FIB column) Ion source (Ga Objective lens Variable apertures Specimen Ion beam Fig. 3.4: Schematics of the ion optics ® The focused ion beam (FIB) column is the part of the CrossBeam workstation, where ions are emitted, accelerated, focused and deflected.
Page 37 PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå The electrostatic condenser collimates and focuses the ion beam depending on the operating Condenser mode. After passing the condenser, the beam current is defined by a set of software-controlled mechan- Probe currents ical apertures. By using the different apertures in combination with the different condenser set- tings, the probe current can be continuously adjusted in the range between 1 pA and 50 nA.
Page 38: Imaging Modes
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.4.1. Imaging modes The following imaging modes are available: Imaging mode FIB Mode.. Characteristics Typical application SEM imaging Electron beam is active, High resolution FESEM ion beam is blanked. The SE signal is synchronised to the SEM scan. FIB imaging Electron beam is blanked, Channelling contrast imaging,...
Page 39: Signal Detection
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.5. Signal detection The interaction products most frequently used for the generation of images in scanning electron microscopy are secondary electrons (SEs) and backscattered electrons (BSEs). For the separa- tion and detection of SEs and BSEs one has to consider two parameters: Energy and angle dis- tribution.
Page 40: In-Lens Detector
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.5.1. In-lens detector The In-lens detector (1) is a high efficiency detector for high resolution SE imaging. It is located above the objective lens (3) and detects directly in the beam path (2). The detection efficiency of this detector results from its geometric position in the beam path and from the combination with the electrostatic/electromagnetic lens.
Page 41: Se2 Detector
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.5.2. SE2 detector The SE2 detector (3) is a Everhart-Thornley type detector. It detects SEs as well as BSEs. Electrons moving to the detector are attracted by the collector grid (2) and directed to the scintil- lator. The collector voltage can be varied in the range between -250 V and + 400 V. This collector voltage generates an electrical field in front of the detector thus directing the low energy SEs to- wards the scintillator.
Page 42: Inlensduo Detector (Optional)
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.5.3. InlensDuo detector (optional) The InlensDuo detector (1) allows simultaneous imaging and mixing of a high contrast topography (SE) as well as clear compositional contrast (BSE). It is an annular shaped in-column detector that is located in place of the In-lens detector. InlensDuo detector Objective lens Filtering grid...
Page 43: Sesi Detector (Optional)
PK=aÉëÅêáéíáçå mêáåÅáéäÉ=çÑ=çéÉê~íáçå 3.4.5.4. SESI detector (optional) econdary Electrons Secondary Ions detector (SESI detector) (3) is suitable to detect sec- ondary electrons as well as secondary ions. The SESI detector replaces the SE2 detector. FIB column Collector grid ® GEMINI column Specimen SESI detector Fig.
Page 44: Specification
PK=aÉëÅêáéíáçå péÉÅáÑáÅ~íáçå 3.5. Specification 3.5.1. Workstation Performance Resolution 1.2 nm at 15 kV and optimum working distance 2.5 nm at 1 kV and optimum working distance Acceleration voltage 0.1 V - 30 kV Probe current 4 pA - 100 nA with integrated High Current - Depth of Field module Magnification 12 - 1.000.000 x ®...
Page 45 PK=aÉëÅêáéíáçå péÉÅáÑáÅ~íáçå Detectors SE2 detector Everhart-Thornley type with optically coupled photomultiplier. Collec- tor bias adjustable from -250V to +400 V. Specimen Current Monitor Specimen Current Monitor, a 6 range auto ranging allowing accurate current measurement in the range 1 pA to 1 µA. In-lens detector ®...
Page 46: Fib Column
PK=aÉëÅêáéíáçå péÉÅáÑáÅ~íáçå 3.5.2. FIB column Performance Resolution < 5 nm at 30 kV Acceleration voltage 1 - 30 kV < 5 kV as an option Probe current 1 pA - 50 nA Magnification range 300 x - 500,000 x Ion optics Ion source Gallium liquid metal ion source...
Page 47: Installation Requirements
PK=aÉëÅêáéíáçå fåëí~ää~íáçå=êÉèìáêÉãÉåíë 3.6. Installation requirements Location requirements Installation site Exclusively inside buildings Room size Min 3.5 m x 5.0 m x 2.3 m (W x D x H) Service area Min 1 m at each side Installation category Exhaust line An exhaust line is required to remove the wate gas of the pre-vacuum pump and to transmit it to the outside.
Page 48 PK=aÉëÅêáéíáçå fåëí~ää~íáçå=êÉèìáêÉãÉåíë Cooling water supply Water flow rate 75 - 85 l/h Input pressure 0.2 - 0.3 MPa (2 - 3 bar) Water temperature 20 - 22°C Stability 0.5°C/10 min Gas supplies Nitrogen Quality 4.6 with nitrogen content <99.996 % Standard Flow rate Approx.
Page 49: Options
3.8. Customer service For customer service please contact your local Carl Zeiss service engineer. A list of Carl Zeiss locations and authorised service partners can be found at: http://www.zeiss.com/microscopy In case of questions regarding radiation protection please contact the Carl Zeiss Radiation Safety Officer Dr.
Page 50 PK=aÉëÅêáéíáçå `ìëíçãÉê=ëÉêîáÅÉ RM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 51: Transport And Storage
QK=qê~åëéçêí=~åÇ=ëíçê~ÖÉ qê~åëéçêí 4. Transport and storage 4.1. Transport CAUTION Crushing hazard while load is being lowered. Maintain a safe distance. Do not walk or place your hands or feet under the load while it is being lowered. Wear safety shoes and gloves. CAUTION Risk of damaging the workstation.
Page 52: Storage
QK=qê~åëéçêí=~åÇ=ëíçê~ÖÉ píçê~ÖÉ 4.2. Storage The packed workstation has to be stored in a dry place. Temperature during storage has to be between +10° C and +70° C. RO=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 53: Installation
RK=fåëí~ää~íáçå 5. Installation Unpacking, installation and first start-up are carried out by authorised Carl Zeiss service staff. =RP=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí ÉåMP...
Page 54 RK=fåëí~ää~íáçå RQ=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 55: Operation
SK=léÉê~íáçå pïáíÅÜáåÖ=çå=íÜÉ=ïçêâëí~íáçå 6. Operation This chapter contains information about: At a glance • Switching on the workstation ® • Starting the SmartSEM user interface ® • Finding your way in the SmartSEM user interface • SEM operation • Electron beam deposition or etching (with GIS upgrade only) ®...
Page 56: Starting The Smartsem
The Windows operating system has been loaded. IMPORTANT ® To receive the Windows login data contact your Carl Zeiss service engineer. Double-click the Carl Zeiss SmartSEM icon. Alternatively, select Start/Programs/Smart- SEM/SmartSEM User Interface. The EM Server opens, loading various drivers.
Page 57 SK=léÉê~íáçå pí~êíáåÖ=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® The EM Server Log On dialogue appears. Enter your user name and password. Confirm by clicking on OK. ® The SmartSEM user interface opens. ® The EM Server is minimised to a small element (icon) on the right side of the Windows task bar.
Page 58: Finding Your Way In The Smartsem
SK=léÉê~íáçå cáåÇáåÖ=óçìê=ï~ó=áå=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® ® 6.3. Finding your way in the SmartSEM user interface 6.3.1. Showing or hiding toolbars Several toolbars such as user toolbar, status bar, and annotation bar are available for easy ® access to the SmartSEM functions. Select View/Toolbars.
Page 59: Showing Or Hiding The Data Zone
SK=léÉê~íáçå cáåÇáåÖ=óçìê=ï~ó=áå=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® 6.3.2. Showing or hiding the data zone The data zone is a special group of annotation objects which are used to display current para- meters. You can also include a µ-marker to show the base magnification. Select View/Data Zone/Show Data Zone from the menu.
Page 60: Docking Panels
SK=léÉê~íáçå cáåÇáåÖ=óçìê=ï~ó=áå=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® 6.3.4. Docking panels It is possible to dock various panels onto the main window. The purpose of the docking panel is to keep the area of the image completely clear, as the docking panel is outside the main window. To show the docking panel select View/Tool- bars from the menu.
Page 61 SK=léÉê~íáçå cáåÇáåÖ=óçìê=ï~ó=áå=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® To stick a control panel to the docking panel, click the title bar of the control panel and drag it to the docking panel. The panel becomes integrated into the docking panel. You can stick several control panels to the docking panel.
Page 62: Opening The Panel Configuration Bar
SK=léÉê~íáçå cáåÇáåÖ=óçìê=ï~ó=áå=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® To hide the docking panel deactivate the Docking Panel checkbox. The docking panel is hidden. 6.3.5. Opening the Panel Configuration Bar Select Tools/Goto Panel from the menu. Alternatively, click the arrow button at the side of the image area. The Panel Configuration Bar opens showing an alphabetical list of functions.
Page 63: Sem Operation
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4. SEM operation 6.4.1. Obtaining a first image The following section summarises basic sequences to quickly obtain an image using the SE2 de- tector. To simplify the procedure, the method described mainly uses SEM Control panel and sta- tus bar functions.
Page 64: Preparing The Sample Holder
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.1. Preparing the sample holder IMPORTANT Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, sample holder or stage. Attach the specimen to the stub by using con- ductive carbon, adhesive metal or carbon tape etc.
Page 65: Loading The Specimen Chamber
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.2. Loading the specimen chamber Click the ChamberScope icon in the toolbar. A TV view inside the specimen chamber is shown. CAUTION Risk of damaging the objective lens and/or your specimen Ensure not to hit the objective lens while driving the stage. Change to TV mode to observe the moving stage.
Page 66 SK=léÉê~íáçå pbj=çéÉê~íáçå Go to the Vacuum tab. To ventilate the specimen chamber, click Vent. A message appears asking: ’Are you sure you want to vent?’. Confirm by clicking on Yes. The specimen chamber is filled with gaseous nitrogen. CAUTION Suffocation hazard due to lack of oxygen, since the specimen chamber is ventilated with nitrogen.
Page 67 SK=léÉê~íáçå pbj=çéÉê~íáçå IMPORTANT Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, sample holder or stage. Keep the chamber door open as short as possible. All sample holders are equipped with a dovetail so that the position of the sample holder is exactly de- fined.
Page 68 SK=léÉê~íáçå pbj=çéÉê~íáçå 10 In the SEM Control panel, click Pump. The vacuum status messages show the current vacuum levels achieved. SU=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 69: Locating The Specimen
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.3. Locating the specimen In TV mode (ChamberScope), look into the specimen chamber. CAUTION Risk of damaging the objective lens and/or your specimen. Ensure not to hit the objective lens while driving the stage. Change to TV mode to observe the moving stage.
Page 70: Switching On The Electron Gun
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.4. Switching on the electron gun In the Vacuum tab: Check that EHT Vac ready=Yes is indicated. In the status bar, click Gun. Select Gun On from the pop-up menu. The gun is being run up. TM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 71: Switching On The Eht
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.5. Switching on the EHT ’EHT’ stands for acceleration voltage. This voltage has to be applied to the gun in order to make it emit electrons. Watch the vacuum status messages on the Vacuum tab of the SEM Control panel. When the required vacuum has been reached you will see the message ’Vac Status = Ready’.
Page 72 SK=léÉê~íáçå pbj=çéÉê~íáçå Switch on the EHT: In the status bar, click EHT. Select EHT On from the pop-up menu. The EHT is running up to 10 kV. The status bar buttons are merged, and the All: but- ton appears. Now, the electron beam is on. TO=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 73: Generating An Image
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.6. Generating an image Go to the Detectors tab. Select SE2 from the Detectors drop-down list. It is recommended that you select the SE2 detector to obtain the first image, as this detec- tor provides a good signal-to-noise ratio even at large working distances.
Page 74 SK=léÉê~íáçå pbj=çéÉê~íáçå Set a low magnification e.g. Mag = 500 x: In the toolbar, click the Magnification/Focus icon. Press the left mouse button and drag the mouse to adjust the magnification of 500 x. The current magnification is indicated in the status bar.
Page 75: Optimising The Image
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.7. Optimising the image Set Coarse by toggling the Coarse/Fine button in the status bar. Step by step, set a high magnification, e.g. Mag = 50.000 x. Focus in between. When selecting high magnifications it is recommended that you move the specimen by using the Beam Shift function instead of driving the stage.
Page 76 SK=léÉê~íáçå pbj=çéÉê~íáçå A small scan frame is shown. The image outside the scan frame is frozen. Size and position of the scan frame can be changed by dragging and dropping. Focus the image in the reduced raster. Align the aperture: In the Apertures tab, activate the Focus Wobble checkbox.
Page 77 SK=léÉê~íáçå pbj=çéÉê~íáçå In the Scanning tab, set Scan Speed = 7. Bring the image into focus. Toggle to Fine in the status bar. Use Coarse and Fine mode of adjustment where appropriate. 10 Correct astigmatism: Select a detail (e.g. a mark or an edge) on the specimen surface.
Page 78 SK=léÉê~íáçå pbj=çéÉê~íáçå In the Apertures tab: Click Stigmation. In the Stigmation box, use the arrow but- tons or the left and right slider to obtain the sharpest possible image. 11 Deactivate the reduced raster. 12 In order to reduce image noise, select a slower scan speed, e.g.
Page 79: Saving The Image
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.8. Saving the image Stop the scan: Go to the Scanning tab. In the Noise Reduction section, select Freeze on = End Frame from the drop- down menu. Click Freeze. A red dot at the right bottom of the image area indicates that the image is frozen.
Page 80 SK=léÉê~íáçå pbj=çéÉê~íáçå To continue imaging, unfreeze the image by selecting Image/Unfreeze from the menu. Alternatively, you can click Unfreeze in the Scanning tab. UM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 81: Finishing The Work Session
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.1.9. Finishing the work session To finish your work session, switch off the EHT: In the status bar, click All:. Select EHT Off from the pop-up menu. It is recommended that you leave the gun on during the working week. This should help to optimise lifetime of the cathode.
Page 82: Setting Detection Parameters
SK=léÉê~íáçå pbj=çéÉê~íáçå 6.4.2. Setting detection parameters 6.4.2.1. Selecting a detector Go to the Detectors tab of the SEM Control panel. Select the detector from the Detectors drop- down menu. The following table should serve as a help to find the required settings for your application. Typical Detectors Detector settings...
Page 83: Using The Se2 Detector
SK=léÉê~íáçå bäÉÅíêçå=ÄÉ~ã=ÇÉéçëáíáçå=çê=ÉíÅÜáåÖ=EïáíÜ=dfp=ìéÖê~ÇÉ=çåäóF 6.4.2.2. Using the SE2 detector Select the SE2 detector. Set the collector bias (voltage) in the Detec- tors tab of the SEM Control panel. 6.5. Electron beam deposition or etching (with GIS upgrade only) Requires a gas injection system (GIS). Depositing and etching with the electron is a suitable method for materials that cannot be pro- cessed with the focused ion beam, e.g.
Page 84: Heating The Reservoirs
SK=léÉê~íáçå bäÉÅíêçå=ÄÉ~ã=ÇÉéçëáíáçå=çê=ÉíÅÜáåÖ=EïáíÜ=dfp=ìéÖê~ÇÉ=çåäóF 6.5.1. Heating the reservoirs The reservoirs - except for the fluorine precursor (XeF ) - are heated in order to liberate the pro- cess gases from the precursor substances and to improve their reactivity. The fluorine precursor (XeF ) is never heated, but cooled, because this substance is volatile at room temperature.
Page 85: Depositing Or Etching With The Electron Beam
SK=léÉê~íáçå bäÉÅíêçå=ÄÉ~ã=ÇÉéçëáíáçå=çê=ÉíÅÜáåÖ=EïáíÜ=dfp=ìéÖê~ÇÉ=çåäóF 6.5.2. Depositing or etching with the electron beam CAUTION Danger of damaging GIS micro stage or specimen. Make sure to position the specimen surface at a safe working distance. Procedure Open the Panel Configuration Bar. Double-click E-Beam Deposition and Etch. The E-Beam Deposition and Etch panel opens.
Page 86: Crossbeam ® Operation
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® ® 6.6. CrossBeam operation ® It is assumed that the operator is already familiar with general functions of SmartSEM and the operation of the FESEM. IMPORTANT ® ® For general information about SmartSEM refer to the Software Manual SmartSEM 6.6.1.
Page 87: Adjusting Tilt Eucentricity
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.1.2. Adjusting tilt eucentricity Before you can start imaging or milling, it might be necessary to adjust tilt eucentricity. By adjust- ing the eucentricity, the specimen surface is moved into the tilting plane of the super-eucentric stage.
Page 88: Switching On The Ion Beam (Fib)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.1.3. Switching on the ion beam (FIB) Go to the FIB tab of the FIB Control panel. Ensure the FIB Gun Pressure is better than 5 x 10 mbar. CAUTION Danger of arcing. Danger of damaging the ion source. Before switching on the ion beam, ensure the FIB gun pressure is better than 5x10 mbar.
Page 89 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® The FIB tab of the FIB Control panel opens. IMPORTANT Do not change the FIB Extr. Target value. Changing this value would require a complete adjustment of the FIB probe currents. Ensure the Regulate checkbox is activated. This guarantees a stable emission current.
Page 90 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® IMPORTANT From time to time, the gallium emitter has to be regenerated by heating. The heating pro- cedure removes the gallium oxide which has been created during operation or during longer breaks. In general, it is recommended that you activate the automatic heating function. This will ensure that the ion source is heated automatically if required.
Page 91 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Initialise the FIB apertures: Click Init Aperture. The aperture initialisation may require several sec- onds. To switch on the ion beam, On. The FIB Gun is ramping up. The gun valve is opened automatically. =VN=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí ÉåMP...
Page 92 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Below the Off button, the emission current is shown. The emission current should be about 2 µA. The background of the button can have several col- ours. Green background: The emission current equals the target (+/- 0.1 µA). Yellow background: The emission current differs from the target by more than 0.1 µA.
Page 93: Setting The Coincidence Point
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.1.4. Setting the coincidence point Before you can start imaging or milling, you have to align the specimen to the coincidence point. The coincidence point is the crossing point of electron beam and ion beam. Only if a specimen feature is located in the coincidence point, it can be imaged simultaneously as well in SEM mode as in FIB mode.
Page 94: Milling For Depth
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.2. Milling for depth Milling stands for the local removal of surface material by means of the focused ion beam. Milling for depth is a milling mode, which allows removing a given depth. The complete sequence includes: At a glance •...
Page 95 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Click into the image area, where you wish to place the milling object. Hold the left mouse button and drag. The milling object is displayed on the screen. The green side of the milling object opposite the red side accentuates the side, where the process will start.
Page 96 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Set the geometrical slope to be milled: At Slope (Degrees) enter 0. Set the Depth in µm. This defines how deep the milling should go at the lamella edges. Set the Number of Layers. The number of layers determines how often a milling element is milled.
Page 97: Starting The Milling Procedure
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.2.2. Starting the milling procedure Click Clear List. All previous milling objects are deleted from the milling list. Click Add. The current milling object is - together with the selected milling conditions - added to the milling list.
Page 98 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® To start the milling, go to the Shape tab and click Mill. The milling process starts. The progress marker is shown. The Mill tab opens, which allows you to directly control the milling progress. The milling process ends automatically. VU=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 99: Recording Images During Milling
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.3. Recording images during milling When selecting the imaging mode Mill+SEM, images can be saved any time during milling. How- ever, the images may be interfered by the ion beam. To avoid any interferences, you can pause the milling while you are taking an image. To record a FIB image, click Grab FIB Frame.
Page 100: Gas Assisted Deposition: Platinum (With Gis Upgrade Only)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.4. Gas assisted deposition: Platinum (with GIS upgrade only) Requires FIB column and GIS. A common ion-beam induced deposition is the deposition of platinum, which serves e.g. as a sur- face protection layer. This section summarizes the procedure for the platinum depsition as a mod- IMPORTANT For details on the deposition of other materials, refer to the Software Manual ®...
Page 101 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® IMPORTANT It is recommended that you switch on the precursor heating at least two hours before you start the deposition procedure. If required, initialise the GIS micro stage: Go to the GIS tab. Click Stage Initialise. Continue with outgassing the platinum precursor.
Page 102: Outgassing The Platinum Reservoir (Only With Five-Channel Gis)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.4.2. Outgassing the platinum reservoir (only with five-channel GIS) Outgassing is required to remove excess gas from the reservoir. If a channel is not used daily, the gas pressure in the reservoir is built up. Therefore, outgassing is necessary to avoid that the FIB vacuum level exceeds and decreases abruptly when the reservoir valve is opened.
Page 103 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® In the Platinum row, click Outgas. The Outgassing panel opens. In the SEM Column Valve field: Click Close. The column chamber calve in the SEM is closed. The FIB gun valve is closed simultaneously. Click the Open Time field and enter 2 sec- onds.
Page 104 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 11 To start the outgassing procedure, click on Go. 12 Monitor the system vacuum by observing the System Vacuum value in the Outgassing panel. If, after the 5th loop, the vacuum has not reached 2 x 10 mbar or better, which is the pressure necessary for deposition, repeat the procedure.
Page 105: Selecting Deposition Conditions
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.4.3. Selecting deposition conditions Preconditions: • Specimen has been moved to the coincidence point • The platinum precursor has been heated and outgassed Procedure: Switch on the electron beam: Switch on the gun. Switch on the EHT. Go to the FIB tab of the FIB Control panel.
Page 106 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Select Fine Rectangle from the drop-down menu. Click into the image area, where you wish to place the milling object. Hold the left mouse button and drag. The milling object is displayed on the screen. The Shape tab opens. Enter the required parameters: Milling Mode: Deposition Mode Width: 10 µm...
Page 107: Starting The Deposition Procedure
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.4.4. Starting the deposition procedure Click Clear List. All previous milling objects are deleted from the milling list. Click Add. The current milling object is - together with the selected milling conditions - added to the milling list.
Page 108 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® To start the deposition, go to the Shape tab and click Mill. The GIS micro stage is moved automatically to the pre-defined position, which has been assigned to Platinum. The deposition process starts. The Mill tab opens, which allows you to directly control the deposition process.
Page 109 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® The deposition process ends automatically. Move the GIS micro stage to the park position: Go to the GIS tab. Click Parked. The GIS micro stage is driven to the safe park position. IMPORTANT If you activate the GIS Auto Park checkbox in the Options tab before starting the deposition (step 5), the GIS micro stage is automatically driven to the safe park position.
Page 110: Setting Detection Parameters
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.5. Setting detection parameters 6.6.5.1. Using the SESI detector (optional) The SESI detector allows the acquisition of FIB secondary ion images and electron images. The following table should serve as a help to find the required settings for your application. Operating Detected Typical...
Page 111 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® In order to toggle between SE Mode and Ion mode, tick/untick the ION Mode check- box. Set the Collector Voltage. SESI Control panel Alternatively: Open the Panel Configuration Bar. Double-click SESI Control. The SESI Control panel opens. Select the desired settings.
Page 112: Adjusting A Fib Probe Current At High Kv (30 Kv)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.6. Adjusting a FIB probe current at high kV (30 kV) 6.6.6.1. Overview The FIB probe current is defined by emission current, condenser voltage and aperture diameter. Canion FIB Range FIB probe currents Aperture diameter Aperture No. Low probe currents 1, 2, 5 pA 10 µm...
Page 113 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® The extraction current should be kept constant while the other parameters can be changed in the Preparing the adjustment FIB Alignment panel. Possible reasons: • After having changed the FIB Extractor Target Depending on the operator’s experience it may take up to a few hours to run through this proce- dure thoroughly.
Page 114: Adjusting A Low Probe Current (Pa)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.6.2. Adjusting a low probe current (pA) Procedure: Load the Faraday cup. Go to the coincidence point at 54°. Ensure that the emission of the ion beam is stable. Go to FIB Control/Align and select a probe cur- rent.
Page 115 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 11 Wobble the aperture: Select ON Focus from the drop-down menu. Move the aperture: Use the buttons in the Aperture Steps field. Use only Medium or Fine. The aperture has been aligned correctly when the image does not shift any more during the focus/un- focus cycle.
Page 116: Adjusting A High Probe Current (Na)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.6.3. Adjusting a high probe current (nA) For the higher currents (nA range) usually the largest apertures need to be selected. It is very dif- ficult to achieve a circular beam profile without halo by using the Focus wobble procedure.
Page 117 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® In the Align tab of the FIB Control panel: Click Backlash Correction. Check the spot shape. Click Save. 10 Repeat the procedure for all other nA probe cur- rents. 11 If necessary optimise the probe current with the Defocus option (refer to section 6.6.6.4.).
Page 118: Optimising A High Probe Current (Na)
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.6.4. Optimising a high probe current (nA) A probe current can have a halo round the center which significantly decreases the performance in terms of sputter rate and steepness of the side walls of a cross section. If you cannot remove the halo by standard aperture alignment, use the defocus option.
Page 119 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® IMPORTANT The defocus value is different for each current. Enter a defocus value, e.g. 20V in the Mill Defocus window Activate the Force Defocus checkbox. The Defocus value is now applied when using spot mode. Burn a spot into the specimen for about 5 s to evaluate the spot quality: Use the Spot mode.
Page 120 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Repeat steps 5 to 7 until the burned spot is round. If the correct defocus voltage is reached, click Save. 10 Deactivate the Force Defocus checkbox. Now, the adjustment is complete. NOM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 121: Adjusting Beam Shift Correction
SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® 6.6.6.5. Adjusting Beam Shift correction The Beam Shift correction is used to correct the different beam positions of the different probe current settings. Because of the different condenser settings the beam path through the column can be slightly different. Therefore, the beam hits the sample at different locations. This can be corrected by using a part of the Beam Shift (called Beam Shift correction).
Page 122 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Crosshairs are displayed in the image area. Move the crosshairs to a selected position. To move the crosshairs, click the square in the centre and drag. In the FIB Control/Align tab, select the next smaller probe current from the drop-down menu.
Page 123 SK=léÉê~íáçå `êçëë_É~ã çéÉê~íáçå ® Click Save to save the adjustments. Repeat steps 5 to 7 with the next smaller probe current. Adjust all smaller probe currents with this proce- dure. 10 Select the 30kV:50 pA reference current to check the original position of the crosshairs. If necessary move the crosshairs to the original position.
Page 124: Using The Help Functions
SK=léÉê~íáçå rëáåÖ=íÜÉ=ÜÉäé=ÑìåÅíáçåë 6.7. Using the help functions ® The SmartSEM user interface offers a multitude of help texts containing information on the operation of the workstation, the optimization of the images and the handling of accessory options. ® 6.7.1. Calling the SmartSEM help Press <F1>.
Page 125: Calling The Context-Sensitive Help
SK=léÉê~íáçå rëáåÖ=íÜÉ=ÜÉäé=ÑìåÅíáçåë 6.7.2. Calling the context-sensitive help Press <SHIFT+F1>. Alternatively, select Help/What’s This from the menu. The mouse cursor is equipped with a question mark. Move the cursor to the area of interest on the screen. Click the left mouse button. The help text is shown.
Page 126: Using The Step-By-Step Guides
SK=léÉê~íáçå rëáåÖ=íÜÉ=ÜÉäé=ÑìåÅíáçåë 6.7.4. Using the step-by-step guides The step-by-step guides provide quick information on important operation sequences. 6.7.4.1. Getting started Select Help/Getting started from the menu. Click the topic of interest. 6.7.4.2. Frequently used operation sequences Select Help/How To from the menu. Click the topic of interest.
Page 127: Calling The Short Cuts Help
SK=léÉê~íáçå rëáåÖ=íÜÉ=ÜÉäé=ÑìåÅíáçåë 6.7.5. Calling the short cuts help ® Many functions and menus which are often used in the SmartSEM user interface can also be opened using the keyboard. A list of short cuts (key combinations) can be displayed in the Smart- ®...
Page 128: Showing Information About Smartsem
SK=léÉê~íáçå rëáåÖ=íÜÉ=ÜÉäé=ÑìåÅíáçåë ® 6.7.6. Showing information about SmartSEM 6.7.6.1. Version history The Release Notes summarise important information about the software version history. New functions, bug fixes and special features of the different versions are explained. Select Help/Release Notes from the menu. ®...
Page 129: Closing The Smartsem ® User Interface
SK=léÉê~íáçå `äçëáåÖ=íÜÉ=pã~êípbj =ìëÉê=áåíÉêÑ~ÅÉ ® ® 6.8. Closing the SmartSEM user interface 6.8.1. Logging off Select File/Log Off from the menu. A window appears asking for confirmation to close the session. Confirm by clicking on the Yes button. The electron-optical parameters are filed in a mac- ro in the individual user directory.
Page 130: Switching Off The Workstation As A Matter Of Routine
SK=léÉê~íáçå pïáíÅÜáåÖ=çÑÑ=íÜÉ=ïçêâëí~íáçå=~ë=~=ã~ííÉê=çÑ=êçìíáåÉ 6.9. Switching off the workstation as a matter of routine 6.9.1. Changing to STANDBY mode Change to STANDBY mode when the workstation is not operated, even for longer periods. The SEM filament will continue to be heated, and the vacuum in electron optical column, ion col- umn and specimen chamber will be maintained.
Page 131: Changing To Off Mode
SK=léÉê~íáçå pïáíÅÜáåÖ=çÑÑ=íÜÉ=ïçêâëí~íáçå=~ë=~=ã~ííÉê=çÑ=êçìíáåÉ 6.9.2. Changing to OFF mode Change to OFF mode in case the workstation needs to be reset. Switch off the EHT. ® Close SmartSEM Select File/Exit from the menu. A window appears asking for confirmation to close the session. Confirm by clicking on the Yes button.
Page 132: Switching Off In An Emergency
SK=léÉê~íáçå pïáíÅÜáåÖ=çÑÑ=áå=~å=ÉãÉêÖÉåÅó 6.10. Switching off in an emergency Press the EMO button (1). All power is cut off from the workstation. The EMO button will remain in its depressed position. 6.10.1. Switching on again after an emergency off IMPORTANT Before switching on the workstation, ensure that the reason for the emergency off does not exist any more and that it is safe to switch on the workstation.
Page 133 SK=léÉê~íáçå pïáíÅÜáåÖ=çÑÑ=áå=~å=ÉãÉêÖÉåÅó Turn the ON/OFF switch, which is located at the back of the plinth, to position ON (unless it is already in this position).. Open the main shut-off valve for cooling water (unless it is already open). Open the main shut-off valve for compressed air (unless it is already open).
Page 134: Switching Off The Workstation Completely
SK=léÉê~íáçå pïáíÅÜáåÖ=çÑÑ=íÜÉ=ïçêâëí~íáçå=ÅçãéäÉíÉäó 6.11. Switching off the workstation completely This procedure completely cuts off the workstation from the electrical main supply. Switch off the EHT. ® Close SmartSEM Select File/Exit from the menu. ® The SmartSEM Close UIF window appears asking for confirmation to close the session Confirm by clicking on the Yes button.
Page 135: Maintenance And Repair
7. Maintenance and repair To maintain best performance of the microscope it is essential to perform preventive maintenance at regular intervals. 7.1. Maintenance work The preventive maintenance is performed by the ZEISS service representative and includes the following items: • Inspection •...
Page 136: Change Of Consumables And Chemicals
TK=j~áåíÉå~åÅÉ=~åÇ=êÉé~áê `Ü~åÖÉ=çÑ=Åçåëìã~ÄäÉë=~åÇ=ÅÜÉãáÅ~äë 7.3. Change of consumables and chemicals The change of consumables and chemicals have to be done by a Carl Zeiss servce engineer in mandatory intervals. The times scheduled are designed for the maximum equipment performance level: Interval Component/Part...
Page 137: Troubleshooting
Carl Zeiss service engineer. DANGER Danger to life: Hazardous voltage inside the workstation . Only service engineers trained and authorised by Carl Zeiss are allowed to service the workstation and to perform work on the electrical system of the workstation. Keyword...
Page 138 Image quality Image quality gets worse, but Cathode has been damaged Call the local Carl Zeiss service there is no change in total emis- due to arcing. engineer to have the cathode sion current. replaced.
Page 139: Chamber
On the menu, select Stage/Stage initialise. In the window SmartSEM, click Yes. IMPORTANT If initialisation of the stage does not solve the stage problem, contact your local Carl Zeiss service engineer. 8.2.2. Replacing the chamber door seal Reasons • Chamber door does not close tightly, bad chamber vacuum...
Page 140 UK=qêçìÄäÉëÜççíáåÖ `Ü~ãÄÉê Remove the chamber door o-ring (1). Insert the new chamber door o-ring. Close the chamber door. Pump the specimen chamber. NQM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 141: Column
UK=qêçìÄäÉëÜççíáåÖ `çäìãå 8.3. Column 8.3.1. Baking ot the gun head The pumping capacity of the ion getter pump decreases in the course of time, thus deteriorating the ’Gun vacuum’. This can be remedied by an ion getter pump bakeout as a regular maintenance procedure.
Page 142 UK=qêçìÄäÉëÜççíáåÖ `çäìãå Remove the high voltage plug: Take hold of high voltage line and high voltage plug. Pull it upwards. CAUTION Danger of contamination Ensure to properly cover gun head area and high voltage plug. Cover the gun head area with aluminium foil. Wrap the high voltage plug in aluminium foil or in an antistatic bag to avoid contamination.
Page 143 UK=qêçìÄäÉëÜççíáåÖ `çäìãå CAUTION Risk of injury from hot surfaces during bakeout Parts of the enclosure in the upper range of the column may become hot during bakeout, particularly after a long bakeout cycle. Do not touch any parts of the cover panel or place any combustible objects on the grid of the electron optical column.
Page 144: Ion Source (Workstation With Fib)
The FIB tab of the FIB Control Panel opens. The life of the ion source is indicated as µAh. IMPORTANT When the lifetime of the ion source approaches 1500 µAh you should contact the Carl Zeiss service to have the ion source replaced. 8.3.2.2. Regenerating by heating The heating procedure is used •...
Page 145 UK=qêçìÄäÉëÜççíáåÖ `çäìãå Procedure In the FIB tab of the FIB Control panel, check the FIB Gun Pressure. The FIB Gun Presssure must be better than 5 x 10 mbar. CAUTION Danger of arcing. Danger of damaging the ion source. Before switching on the ion beam, ensure the FIB gun pressure is better than 5 x 10 mbar.
Page 146 Continue with initialising the FIB apertures (see section 6.6.1.3. step 7). If you heated manually because the ion source does not start emitting: • Contact the local Carl Zeiss service if the emis- sion current does not increase again. NQS=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 147: Power Circuit
UK=qêçìÄäÉëÜççíáåÖ mçïÉê=ÅáêÅìáí 8.4. Power circuit 8.4.1. Checking the circuit breakers DANGER Danger to life: Hazardous voltage inside the workstation. Checking and changing fuses may only be carried out by an electrically skilled person in accordance with national safety regulations. Turn off and lock out the workstation before opening the protective cover. Reasons •...
Page 148 UK=qêçìÄäÉëÜççíáåÖ mçïÉê=ÅáêÅìáí Remove the protective cover. Check the fuses. Replace as necessary. Value Circuit Value Circuit Water magnetic valve IGP power supply Res 1 (spare) Bakeout heater 1 Res 2 (spare) Bakeout heater 2 Mains PSU: Vac supply voltage Spare Turbo pump power supply and VP microscope: RBV angle valve...
Page 149 UK=qêçìÄäÉëÜççíáåÖ mçïÉê=ÅáêÅìáí Mount the protective cover. Tighten the screws (1). Plug in the power cord. Turn the ON/OFF switch to ON position. 10 Restart the workstation. =NQV=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí ÉåMP...
Page 150 UK=qêçìÄäÉëÜççíáåÖ mçïÉê=ÅáêÅìáí NRM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 151: Shutdown And Disposal
If the workstation will not be used for an extended period of time e.g. several months, it should be put out of operation. Contact your local Carl Zeiss service engineer to have the workstation put out of operation. The service engineer will see to that the cooling water is completely removed from the interior of the FESEM.
Page 152: Disposing Of The Workstation
VK=pÜìíÇçïå=~åÇ=Çáëéçë~ä aáëéçë~ä 9.2.2. Disposing of the workstation The operator must ensure that waste products are disposed of and recycled in a responsible man- ner. Refer to EC directive 2002/96/EC on waste electrical and electronic equipment (WEEE). The workstation consists of several modules. Be careful to separate the materials properly when you dispose of the workstation.
Page 153: Parts And Tools
10. Parts and tools CAUTION Risk of injury or property damage Use genuine Carl Zeiss parts only. Order parts and tools at your local Carl Zeiss service organisation. 10.1. Important consumables Item Part no. Schottky field emitter By DENKA...
Page 154: Important Spare Parts
NMK=m~êíë=~åÇ=íççäë fãéçêí~åí=ëé~êÉ=é~êíë 10.2. Important spare parts Item Part no. Set of fuses 348200-8801-000 Chamber door o-ring 113-880 10.3. Tools and accessories Item Part no. 3 mm Allen key 0015-247 1.5 mm Allen key 151-883 Small pliers Sample holders Refer to sample holder catalogue. Stubs Tweezers TEM oil 300...
Page 155: Abbreviations
NNK=^ÄÄêÉîá~íáçåë 11. Abbreviations Alternating current Ampere interrupting capacity Backscattered electron Charge Compensator Charge coupled device Depth European community Extra high tension EIGA European Industrial Gases Association Electromagnetic compatibility Emergency off ® Energy selective backscattered FESEM Field emission scanning electron microscope Graphical user interface Height Ion getter pump...
Page 156 NNK=^ÄÄêÉîá~íáçåë NRS=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 157: Glossary
NOK=däçëë~êó 12. Glossary Aperture Small opening in the beam path that forms and limits the electron or ion beam. Astigmatism Lens aberration that distorts the shape of the electron beam, compen- sated by the stigmator. Backscattered electrons High energy electrons that are liberated from the specimen surface when the specimen is hit by the primary electron beam.
Page 158 NOK=däçëë~êó Scintillator Substance that absorbs electrons and in response, fluoresces photons while releasing the previously absorbed energy. Primary electrons Narrowly bundled beam of accelerated electrons that hit the specimen surface. X-ray Type of ionising radiation that is generated during the operation of elec- tron microscopes NRU=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 159: Declaration Of Conformity
13. Declaration of conformity ® Denomination: CrossBeam workstation ® Model: AURIGA Compact Carl Zeiss Microscopy GmbH Carl-Zeiss-Str. 22 Manufacturer 73447 Oberkochen Germany This is to declare that the machinery mentioned above fulfils all relevant provisions of the: EC Directives 2006/42/EC Machinery Directive...
Page 160 NPK=aÉÅä~ê~íáçå=çÑ=ÅçåÑçêãáíó NSM=çÑ=NSQ fåëíêìÅíáçå=j~åì~ä=^ìêáÖ~=`çãé~Åí=ÉåMP...
Page 161: Index
NQK=fåÇÉñ 14. Index Electron beam etching 83 Abbreviations 155 Emergency off 132 Acceleration voltage 35 EMO button 20 Airlock 26 Etching 83 Altitude 48 Evacuating 33 Aluminium foil 142 Exhaust line 47 Ambient Temperature 48 Ampere interrupting capacity AIC 47 Anode 34 Faraday cup 113 Apertures 35...
Page 162 NQK=fåÇÉñ Room size 47 Keyboard 31 Safety 8 Labels 21 Safety devices 18 Lifetime of ion source 144 Safety instruction 8 Lithography 96 Safety labels 21 Location requirements 47 Schottky field emitter 34 Scintillator 136 SE2 detector 39 Magnification 93 SEM imaging 38 Main shut-off valves 20 Service 13...
Page 163 NQK=fåÇÉñ Water 83 Water flow rate 48 Water temperature 48 WD 40 WEEE 152 Wobble 76 Working distance 40 X-rays 14 =NSP=çÑ=NSQ ∆ fåëíêìÅíáçå=j~åì~ä=^rofd^ =`çãé~Åí=ÉåMP...
Page 164 CB1 3JS microscopy@zeiss.com Carl Zeiss Microscopy, LLC One Zeiss Drive Thornwood, NY 10594 microscopy@zeiss.com Plus a worldwide network of distributors www.zeiss.com/microscopy Due to a policy of continuousdevelopment, we reserve the right to change specifications without notice. © Carl Zeiss Microscopy GmbH...

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