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HCD-XG100AV/XG900AV
MD OUT:
(phono jacks)
voltage 250 mV
impedance 1 kilohm
WOOFER OUT (phono jack):
voltage 1 V, impedance
1 kilohm
FRONT SPEAKER:
accepts impedance of 6 to
16 ohms
CENTER SPEAKER:
accepts impedance of 8 to
16 ohms
REAR SPEAKER:
accepts impedance of 8 to
16 ohms
* AEP, UK and Mexican models only
Video section
Inputs
VIDEO IN (phono jack): 1 V p-p, 75 ohms
GAME IN (phono jack):
1 V p-p, 75 ohms
Output
VIDEO OUT (phono jack):1 V p-p, 75 ohms
CD player section
System
Compact disc and digital
audio system
Laser
Semiconductor laser
(λ=780nm), Emission
duration: continuous
Wavelength
780 – 790 nm
Frequency response
2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 90 dB
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength:
660 nm
Output level
–18 dBm
Tape player section
Recording system
4-track 2-channel stereo
Frequency response
40 – 13,000 Hz (±3 dB),
(DOLBY NR OFF)
using Sony TYPE I cassette
40 – 14,000 Hz (±3 dB),
using Sony TYPE II cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz
(50 kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohm unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
European, Middle Eastern, and Philippine models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
Other models:
531 – 1,602 kHz
(with the interval set at 9
kHz)
530 – 1,710 kHz
(with the interval set at 10
kHz)
Antenna
AM loop antenna
Antenna terminals
External antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
AEP, UK models:
230 V AC, 50/60 Hz
Mexican model:
120 V AC, 50/60 Hz
Australian model:
230 – 240 V AC, 50/60
Hz
Other models:
120 V, 220 V or 230 – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
HCD-XG900AV
200 watts
0.6 watts (at the power
saving mode)
HCD-XG100AV
230 watts
Approx. 355 × 425 × 450
Dimensions (w/h/d)
mm
Mass :
HCD-XG900AV
Approx. 14.5 kg
HCD-XG100AV
Approx. 16.0 kg
Design and specifications are subject to change
without notice.
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
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