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comparableconductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe
all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity sufficientto damage
an ES device).
3. Precaution of Laser Diode
4. Handling the Lead-free Solder
5
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