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AEC-Q200 Test Item
18 Board Flex
Appearance
Capacitance
Change
Q/D.F.
I.R.
19 Terminal
Appearance
Strength
Capacitance
Change
Q/D.F.
I.R.
20 Beam Load Test
JEMCGS-0363S
Specification.
Temperature
Compensating Type
No marking defects
Within ±5.0% or ±0.5pF
R7/L8/R9: Within ±10.0%
(Whichever is larger)
30pFmin. : Q≧1000
R7/L8 : W.V.: 25Vmin.: 0.025 max.
30pFmax.: Q ≧400+20C
W.V.: 16V/10V : 0.035max.
C: Nominal Capacitance(pF) R9 : 0.05max.
More than 10,000MΩ or 500Ω ・F
(Whichever is smaller)
b
f4.5
a
100
Fig.1
No marking defects
Within specified tolerance
30pFmin. : Q≧1000
R7/L8 : W.V.: 25Vmin.: 0.025 max. method and should be conducted with care so that the soldering is
30pFmax.: Q ≧400+20C
W.V.: 16V/10V : 0.035max.
C: Nominal Capacitance(pF) R9 : 0.05max.
More than 10,000MΩ or 500Ω ・F
(Whichever is smaller)
b
ﾗﾝﾄﾞ
a
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness ≦0.5mm rank : 8N
< Chip L dimension : 3.2mm max. >
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N
■AEC-Q200 Murata Standard Specification and Test Methods
High Dielectric Type
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
shown in Fig 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Type
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
t : 1.6mm
(GCM03/15:0.8mm
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig.3 using a eutectic solder. Then apply *18N force in parallel with
the test jig for 60sec.
The soldering should be done either with an iron or using the reflow
uniform and gree of defects such as heat shock
f4.5
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip Length : 2.5mm max. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : *0.5mm / sec.
*GCM03: 0.1mm/sec.
5
AEC-Q200 Test Method
ｺﾝﾃﾞﾝｻ
a
b
0.3
0.9
0.5
1.5
0.6
2.2
0.8
3.0
45
45
支持台
2.0
4.4
2.0
4.4
*1,2：2.0±0.05
4.0±0.1
114
20
＊1
＊2
+0.1
φ1.5
-0
Pressurizing
speed:1.0mm/s
Pressurize
R4
Ａ
0.05以下
Flexure：≦2
Capacitance meter
(High Dielectric Type)
Flexure：≦3
45
45
(Temperature
Compensating Type)
Fig.2
*2N(GCM03/15)
Type
a
b
GCM03
0.3
0.9
GCM15
0.4
1.5
GCM18
1.0
3.0
GCM21
1.2
4.0
GCM31
2.2
5.0
GCM32
2.2
5.0
c
t: 1.6mm
(GCM03/15: 0.8mm)
Solder resist
Baked electrode or
Copper foil
Fig.3
Iron Board
L
0.6L
Fig.4
c
0.3
0.6
0.9
1.3
1.7
2.6
(in mm)
t
c
0.3
0.5
1.2
1.65
2.0
2.9
（in mm）
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