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Chip Monolithic Ceramic Capacitor for Automotive
GCM21BL81H104KA37_ (0805, X8L:, 0.1uF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GCM
21
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
2.0±0.15
1.25±0.15
4.Rated value
(3) Temperature Characteristics
Temp. coeff
or Cap. Change
-40 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
L
EMBOSSED W8P4
f330mm Reel
K
EMBOSSED W8P4
Product specifications in this catalog are as of Oct.7,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GCM21BL81H104KA37-01
B
L8
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
1.25±0.15
0.2 to 0.7
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 150 °C
DC 50 V
(25 °C)
Packaging Unit
3000 pcs./Reel
10000 pcs./Reel
1H
104
(6)Capacitance
(4)Rated
(5)Nominal
Tolerance
Voltage
Capacitance
(Unit:mm)
g
0.7 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
0.1 uF
±10 %
1
Reference Sheet
K
A37
L
(7)Murata's
(8)Packaging
Control Code
Code
Methods
(Operating
Temp. Range)
-55 to 150 °C
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Related Manuals for Murata GCM21BL81H104KA37 Series
Summary of Contents for Murata GCM21BL81H104KA37 Series
- Page 1 Chip Monolithic Ceramic Capacitor for Automotive GCM21BL81H104KA37_ (0805, X8L:, 0.1uF, DC50V) _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment. 2.MURATA Part NO. System (Ex.) (7)Murata’s (6)Capacitance (1)L/W (2)T (3)Temperature...
- Page 2 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Method AEC-Q200 Test Item Temperature High Dielectric Type Compensating Type Pre-and Post-Stress Electrical Test 2 High Temperature The measured and observed characteristics should satisfy the Set the capacitor for 1000±12 hours at 150±3℃.
- Page 3 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Method AEC-Q200 Test Item Temperature High Dielectric Type Compensating Type The measured and observed characteristics should satisfy the 7 Operational Life Apply 200% of the rated voltage for 1000±12 hours at 125±3℃...
- Page 4 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Method AEC-Q200 Test Item Temperature High Dielectric Type Compensating Type 14 Thermal Shock The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under specifications in the following table.
- Page 5 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Method AEC-Q200 Test Item Temperature High Dielectric Type Compensating Type 18 Board Flex Appearance No marking defects Solder the capacitor on the test jig (glass epoxy board) shown in Fig1 using a eutectic solder. Then apply a force in the direction Capacitance Within ±5.0% or ±0.5pF...
- Page 6 ■AEC-Q200 Murata Standard Specification and Test Methods Specification. AEC-Q200 Test Method AEC-Q200 Test Item Temperature High Dielectric Type Compensating Type 21 Capacitance Capacitance Within the specified tolerance. R7 : Within ±15% The capacitance change should be measured after 5 min. at each specified temperature stage.
- Page 7 Package GCM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Plastic Tape Code:D/E Code:W Code:L Code:J/ F Code:K GCM03 15000(W8P2) 30000(W8P1) 50000(W8P2) 5 (Dimensions Tolerance:±0.05) 10000(W8P2) 20000(W8P1) 50000(W8P2) GCM15 5 (Dimensions Tolerance:±0.1min.) 10000(W8P2) 40000(W8P2) GCM18...
- Page 8 Package GCM Type (3)GCM18/21/31/32 <Paper Tape> (in mm) 4.0±0.1 4.0±0.1 2.0±0.1 +0.1 φ1.5 Ａ LW Dimensions T Dimensions Type Tolerance(Chip) (Chip) GCM18 ±0.1 0.8±0.1 1.05±0.10 1.85±0.10 ±0.15 0.6±0.1 GCM21 1.55±0.15 2.30±0.15 1.1 max. ±0.15 0.85±0.1 GCM31 ±0.15 0.85±0.1 2.00±0.20 3.60±0.20 GCM32 L:±0.3/W:±0.2 0.85+0.15/-0.05...
- Page 9 態 ( 単位： mm) Package GCM Type Fig.1 Package Chips (in mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GCM32 max. 16.5 max. 10±1.5 GCM43/55 20.5 max. 14±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
- Page 10 Package GCM Type ﾌﾟ詰め状態 ( 単位： mm) 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. Tail vacant Section Chip-mounting Unit Leader vacant Section...
- Page 11 Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment...
- Page 12 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
- Page 13 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. Sample: R7 Characteristics 0.1μF, Rated Voltage 50VDC Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
- Page 14 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. ...
- Page 15 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to prevent them from any bending damage or cracking.
- Page 16 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes Reflow deformation inside the components. In order to prevent Temperature(℃) Soldering mechanical damage to the components, preheating is...
- Page 17 Caution 4-2.Flow Soldering [Standard Conditions for Flow Soldering] 1. Do not apply flow soldering to chips not listed in Table 2. Table 2 Temperature(℃) Soldering Soldering Part Number Temperature Differential Peak Gradual Temperature ΔT GC□18/21/31 Cooling ΔT≦150℃ (Except for Temperature Preheating Peak Characteristics:0C,5G,R9,L8)
- Page 18 Caution 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
- Page 19 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
- Page 20 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
- Page 21 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
- Page 22 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 23 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the upper operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
- Page 24 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
- Page 25 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress Land of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for flow soldering, table 2 for reflow soldering.
- Page 26 Notice 3. Board Design When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. Relationship with amount of strain to the board thickness, length, width, etc.] ε= Relationship between load and strain 2Ewh...
- Page 27 Notice 5.Flow Soldering ［As a Single Chip］ Set temperature and time to ensure that leaching of the outer electrode does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as Outer Electrode mounted on substrate.
- Page 28 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.