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2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has
an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Dimensions
Part Number
GC□18
GC□21
GC□31
Table 2 Reflow Soldering Method
Dimensions
Part Number
GC□03
GC□15
GC□18
GC□21
GC□31
GC□32
JEMCGC-2702N
a
Chip（L×W）
1.6×0.8
0.6～1.0
2.0×1.25
1.0～1.2
3.2×1.6
2.2～2.6
Chip（L×W）
a
0.6×0.3
0.2～0.3
1.0×0.5
0.3～0.5
1.6×0.8
0.6～0.8
2.0×1.25
1.0～1.2
3.2×1.6
2.2～2.4
3.2×2.5
2.0～2.4
Chip Capacitor Land
C
b
b
0.8～0.9
0.6～0.8
0.9～1.0
0.8～1.1
1.0～1.1
1.0～1.4
b
0.2～0.35
0.2～0.4
0.35～0.45
0.4～0.6
0.6～0.7
0.6～0.8
0.6～0.7
0.8～1.1
0.8～0.9
1.0～1.4
1.0～1.2
1.8～2.3
25
a
Solder Resist
c
(in mm)
c
(in mm)
Notice
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