Servicing Notes - Sony HCD-GTK1i Service Manual

HCD-GTK1i/GTK2i
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
HOW TO DISASSEMBLE THE FRONT PANEL ASSY
Step: 1) Unscrew the hexagon bolt to remove the handle from the front panel.
2) Unscrew the 3.5 x 14 TAPPING then use the hexagon bolt to screw into hole A. It will raise up the front panel assy by 1-1.5 cm.
3) Use a fl at-head screwdrive to push out the front panel assy from the speaker cabinet. Make sure that your fl at-head screwdriver
away from speaker cabinet so that it does not damage the speaker cabinet.
1
hole A
handle
4
SECTION 1

SERVICING NOTES

2
hole A
handle
1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
front panel assy
3