User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH. TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.
Handling and ESD Tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Page 4 INTRODUCTION The COM Express™ mainboard MB-COME6-4 is a carrier board for COM Express™ modules with Type 6 pinout. It can be used for panel PCs, embedded computers or as an evaluation platform for COM Express™ modules. In combination with a standard COM Express™ module it forms a very compact hardware kit that can be used for a freely scalable embedded PC platform.
UEFI-shell active; no keyboard, no mouse, no mass storage device, no Ethernet cable etc. connected). Note: Power requirement The MB-COME6-4 input current is not fused. The user has to ensure that the input current does not exceed the maximum current of 25 A (300 W).
Molex 51021-1000 crimp housing The COM Express™ Specification does only provide signal definitions for RX and TX lines for the serial interface. Due to the TQ- flexiCFG feature, the serial ports can be configured to route the handshake signals to free pins on the COM Express connector.
The MB-COME6-4 provides an embedded DisplayPort (eDP where suitable displays can be directly connected. To select the eDP interface on the MB-COME6-4 the DIP switch on the carrier has to be set to the “eDP” position. This functionality is only available if the COM Express™ module provides the eDP interface.
The MB-COME6-4 provides a LVDS interface where suitable displays can be directly connected. To select the LVDS interface on the MB-COME6-4 the DIP switch on the carrier has to be set to the “LVDS” position. This functionality is only available if the COM Express™ module provides the LVDS interface.
M.2 socket with B Key (for WWAN modules or SATA SSD devices) The MB-COME6-4 provides a socket to support SATA based M.2 SSDs with 22 mm width and 80 mm length or modules with 22 mm width and 42 mm length.
Page 17 3.5.16 Feature Connector The MB-COME6-4 provides two pin header, where few COM Express™ signals are available. This connector is for debug and software development purposes. The user can access to SMBus, I C bus and a few other signals.
3.5.18 SPI Flash Socket The MB-COME6-4 provides a socket for 3.3 V SPI flash. This is useful if a BIOS update fails or for BIOS development purposes. SPI-Flashes with SO8W package can be inserted. If the “BIOS_DIS1#” jumper is set, the BIOS from the SPI flash in the socket is active.
Figure 14: MB-COME6-4 Dimensions Please contact support@tq-group.com for more details about 2D/3D Step models. Protection Against External Effects The MB-COME6-4 is not protected against dust, external impact and contact (IP00). Adequate protection has to be guaranteed by the surrounding system.
0xAE 5.1.2 SMBus The SMBus (System Management Bus) on the MB-COME6-4 is routed to the PCIe card (optional) and to the feature connector. On this bus no device is connected. Driver Download The MB-COME6-4 module is well supported by the standard operating systems, which already include most of the drivers required.
Most external interfaces are protected using ESD protection diodes. Measurements for ESD protection have to be done with the electronic parts mounted in a housing. Since TQ- Systems GmbH does not offer a housing for the MB-COME6-4, no special preventive measures are taken.
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