User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH. TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.
Handling and ESD Tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
Page 4 INTRODUCTION The SMARC mainboard MB-SMARC-3 is a carrier board for SMARC modules with a pinout based on the SMARC 2.1 specification. It can be used for panel PCs, embedded computers or as evaluation platform for SMARC modules. In combination with a standard SMARC module it forms a very compact hardware kit that can be used for a freely scalable embedded PC platform thanks to its modular design.
UEFI-shell active; no keyboard, no mouse, no mass storage device etc. connected). The maximum input current of the MB-SMARC-3 is limited to 5 A by a fuse. The load caused by devices connected to the carrier board should not exceed 50 W.
ARM specific Serial Downloader Mode Most x86 modules only support the boot sources "Module SPI" and "MB-SMARC-3 SPI". For TQ's x86 SMARC modules only S3-3 (BOOT_SEL2#) is relevant. This toggles between the UEFI BIOS Flash on the module and the mainboard. Booting the operating...
Molex Connector and – – RS-232 D-SUB Connector An ESPI UART is realized on the MB-SMARC-3 to support two more serial ports. SER5 is equipped with an RS232 / RS485 / RS422 multilevel transceiver. Please contact TQ-Support for further information about available serial ports.
3.6.7 Embedded Display Port The MB-SMARC-3 has an embedded DisplayPort (eDP) interface for direct connection of suitable displays. This functionality is only available when the connected SMARC module provides eDP and the multiplexer on the mainboard is switched to eDP interface (DIP switch S2 is “ON”).
3.6.8 LVDS The MB-SMARC-3 provides an LVDS interface for direct connection of suitable displays. This functionality is only available when the connected SMARC module provides LVDS and the multiplexer on the mainboard is switched to LVDS interface (DIP switch S2 is “OFF”).
VCC_IN Backlight voltage input – VCC_BKLT_OUT Backlight voltage output Illustration 13: Backlight Power Connector, Connect pin 1 and 2 to use the 12 V of the MB-SMARC-3 for the backlight. Backlight connector • Connector type: Molex 53398-1271 • Mating connector:...
M.2 Socket with E-Key The MB-SMARC-3 provides the socket X46 to support an M.2 add-in card with 22 mm width and 30 mm length. USB and a PCIe ×1 interface signals are routed to this socket. M.2 2230 single and double sided add-in cards with E or A+E-Keying can be inserted.
SPI Flash Socket The MB-SMARC-3 provides the socket X29 for SPI flash memory. This is useful if a BIOS update fails or for BIOS development purposes. SPI flash memory with SO8W package can be inserted. It depends on the SMARC module used whether a certain flash device is supported.
SMARC signal extension connector V_5V 3.6.24 SMARC connector On the MB-SMARC-3 an MXM3 compatible connector X1 is used to contact the gold contacts of the SMARC module. The stack height (board to board distance between carrier board and module) is 5 mm.
Table 19: Labels on MB-SMARC-3 Label Content Serial number MB-SMARC-3 version and revision, tests performed Protection against External Effects The MB-SMARC-3 is not protected against dust, external impact and contact (IP00). Adequate protection has to be guaranteed by the surrounding system.
Driver Download The MB-SMARC-3 module is well supported by the standard operating systems, which already include most of the drivers required. It is recommended to use the latest drivers for best performance and the full feature set of the module.
Most external interfaces are protected using ESD protection diodes. Measurements for ESD protection have to be done with the electronic parts mounted in a housing. Since TQ-Systems GmbH does not offer a housing for the MB-SMARC-3, no special preventive measures are taken. Shock & Vibration The MB-SMARC-3 is designed to be insensitive to shock and vibration and impact.
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the MB-SMARC-3, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of this subassembly is minimised by suitable measures.
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