Important Notice: Before using the MBa8Xx or parts of the MBa8Xx schematics, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose.
Handling and ESD tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
BRIEF DESCRIPTION This User's Manual describes the hardware of the MBa8Xx as of revision 02xx. The MBa8Xx is designed as a carrier board for the TQ-Minimodules TQMa8Xx and TQMa8Xx4. If not described differently, all descriptions apply to both TQMa8Xx and TQMa8Xx4.
Page 6 ELECTRONICS The following chapters describe the interfaces of the MBa8Xx as of revision 02xx in connection with a TQMa8Xx or TQMa8Xx4 with maximum configuration. If not described differently, all descriptions apply to both TQMa8Xx and TQMa8Xx4. For better readability, the TQMa8Xx is therefore named for both, the TQMa8Xx and the TQMa8Xx4.
0.2 µm gold plating The TQMa8Xx is held in the mating connectors on the MBa8Xx by 280 pins with a retention force of approximately 28 N. To avoid damaging the connectors of the MBa8Xx or the TQMa8Xx while removing the TQMa8Xx, the use of the extraction tool MOZI8XX is strongly recommended.
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Ground – Depends on X1-107 (V_ENET_IN on TQMa8Xx). V_ENET_IN is hard-wired to 1.8 V on the MBa8Xx, see also chapter 3.10. RGMII is not available with the i.MX 8DualX. RMII or an alternate multiplexing function can be used. Depends on X2-11 (V_IO_IN on TQMa8Xx). V_IO_IN is hard-wired to 1.8 V on the MBa8Xx, see also chapter 3.10.
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– Signal V_IO_IN on TQMa8Xx. V_IO_IN is hard-wired to 1.8 V on the MBa8Xx, see also chapter 3.10. Maximum load on pins 11 and 12 is 0.5 A each. Depends on X2-11 (V_IO_IN on TQMa8Xx). V_IO_IN is hard-wired to 1.8 V on the MBa8Xx, see also chapter 3.10.
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Ground – Depends on X2-11 (V_IO_IN on TQMa8Xx). V_IO_IN is hard-wired to 1.8 V on the MBa8Xx, see also chapter 3.10. Changed from JTAG_TRST# to SCU_WDOG_OUT. Signal JTAG_TRST# is not supported anymore by the i.MX 8. ADC reference voltage of the TQMa8Xx is hard-wired to 1.8 V on the MBa8Xx via V_1V8_OUT.
Depending on the application and software load, the number of I C devices used can limit the data throughput or block the bus. For this reason, the devices used on the MBa8Xx can be optionally connected to the I2C2. This assembly option is described in the MBa8Xx schematics.
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Default I2C interface (continued) The following table shows the default I²C device addresses on the MBa8Xx and the TQMa8Xx. For some devices the address can be changed by assembly options. The options are described in detail in the given chapter.
Both I²C lines M4_I2C_SCL and M4_I2C_SDA are provided with 2.2-kΩ pull-up resistors to 1.8 V on the MBa8Xx. To reduce the bus load on I2C1, the I²C devices on the MBa8Xx can be connected to the I2C2 bus. As shown in the following table, the configuration of the used I²C bus is determined by the resistors R371 to R374.
Page 15 GPIO port expander An 8-fold port expander PCA9538A is used to control various components on the MBa8Xx, see Table 12. The port expander is controlled via I2C1. The address of the port expander can be altered by reassembling resistors.
Page 16 Temperature sensor and EEPROM A temperature sensor SE97BTP is populated on the MBa8Xx to monitor the temperature. The same type of sensor is also used on the TQMa8Xx. Both sensors are read out via I2C1, see Table 10.
3.8.6.2) interfaces. The other two USB hosts 3 and 4 are externally accessible as USB 3.0 hosts, see also chapter 3.8.10. Table 17 shows the power management configured on the MBa8Xx with pull-up/- or pull-down resistors. Alternatively, all settings can be adjusted by assembly options.
3.8.2 Both CAN interfaces of the MBa8Xx are directly connected to the CAN ports of the TQMa8Xx and are available at the two 3-pin connectors X11 and X12. Both interfaces are galvanically isolated with 1 kV. The CAN interfaces are not electrically isolated from each other.
Debug USB For the output of debug messages of the TQMa8Xx the MBa8Xx can be connected as USB device via X13 to a host. A total of four UART interfaces are provided via the USB interface, which are converted to USB with the 4-port bridge FT4232.
3.8.4 Ethernet The i.MX 8X CPU and thus the TQMa8Xx provides two independent RGMII interfaces. On the MBa8Xx, both interfaces are configured as Gigabit Ethernet ports. The PHYs support IEEE 802.3 10BASE-Te, 100BASE-TX, and 1000BASE-T. The I/O voltage of the RGMII signals is 1.8 V. Both PHYs are connected with their own PHY reset and interrupt signals.
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The Transceiver DP83867 has boot straps to start with configurable default values. All boot straps can be customized by placement options. Further information is available in the MBa8Xx schematics. The standard configuration on the MBa8Xx is shown in the following table, alternatively, these can be adjusted via register settings or via placement options.
Page 26 3.8.5 GPIO Some GPIOs are used on the MBa8Xx, which are provided by the TQMa8Xx. Some GPIOs are provided via a port expander. The port expander is described in chapter 3.4. The following TQMa8Xx GPIOs are used: Table 29:...
/ DisplayPort In addition to the standard LVDS interface (X14), an eDP or DisplayPort connection is also available on the MBa8Xx to connect monitors. This is implemented with the DSI-Bridge SN65DSI86, which converts both LVDS/DSI ports of the TQMa8Xx to an embedded DisplayPort.
Dual channel LVDS / MIPI_DSI Two separate LVDS interfaces are available on the MBa8Xx. The interfaces are provided by a combined transceiver from the i.MX 8X, which outputs either MIPI-DSI or LVDS. The maximum possible resolutions depend on the type of transceiver. MIPI-DSI supports 1920x1200 (WUXGA) at 60 fps, LVDS supports 1920x1080 (Full HD) at 60 fps.
3.8.7 MIPI CSI The Camera Serial Interface (CSI) of the TQMa8Xx is available on the MBa8Xx on a dedicated connector. Camera data can be processed with max. 4K@30 fps. Connectors and pin assignment correspond to a TQ internal standard, which enables the connection of the TQ camera adapter MBaxCA.
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V_5V_CSI 5 V supply (filtered from V_5V), max 0.5 A in total at pins 56, 58, 60 There are no pull-up resistors on the TQMa8Xx and the MBa8Xx. Additional external pull-ups must be implemented on the CSI adapter if required.
0 Ω – 3.8.9 SIM card A SIM card holder is available on the MBa8Xx for the use of a SIM card (X25), which is directly connected to the Mini PCIe interface. Media type: GSM (SIM cards with form factor 2FF/UICC) Interface TQMa8Xx: –...
Host is 900 mA. Since the TQMa8Xx only provides two USB interfaces and one of them is used as a debug interface on the MBa8Xx, the second USB interface of the TQMa8Xx is connected to a hub, which provides two additional, internally used USB 2.0 hosts in addition to the two USB 3.0 hosts described here.
I/O voltage of 1.8 V since the supply voltage of the SD card is not power-cycled after a system reset on the MBa8Xx revision 02xx. This will be corrected on the MBa8Xx revision 03xx. Because of this behaviour, the host cannot reinitialize the SD card in SDR104 mode at boot time and communication problems may occur.
Note: Observe power consumption with regard to the overall system The supply voltages (1.8 V, 12 V, etc.) provided at the MBa8Xx headers are not individually fused. Technically, an overload of the fuse at the 24 V supply input is therefore possible, see also chapter 3.10.
The JTAG interface is routed to a 20-pin header (X15). The required pull-ups of the lines TDI, TMS, and SRST# are available on the MBa8Xx. All signal lines use 1.8 V as reference voltage. The JTAG interface is not ESD protected. The JTAG mode can be configured by a placement option. Information on this can be found in the MBa8Xx schematics. TQMa8Xx...
Button S6 is directly connected to pin IMX_ONOFF of the TQMa8Xx. Pressing the button triggers the ON/OFF function of the i.MX 8X. 3.9.4 GPI buttons Two buttons (S2, S3) are available on the MBa8Xx for user-specific use. These buttons are connected to two GPIO pins of the TQMa8Xx. Table 46: General Purpose buttons...
Voltage stabilization Attention: Voltages at headers The internal voltages (1.8 V, 12 V, etc.) provided at the MBa8Xx headers are not separately fused. Technically an overload of the fuse is therefore possible. The resulting total current consumption of the MBa8Xx should be kept below 4 A in total.
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24 V supply voltage Ground Figure 22 shows all voltages (rails) on the MBa8Xx, which are divided into three main paths consisting of two LM25119 and one TPS45335. These supply the largest loads. (TQMa8Xx, USB supply, 12 V display supply.) The design also allows power sequencing of all voltage levels used.
V_3V3_MPCIE_EN (V_3V3_MPCIE) PCA9538A TPS54335 IO_6 V_12V_EN (V_3V3_MPCIE) Figure 23: Block diagram Enable signals for Power Sequencing From Figure 23, the following sequencing of the various voltage levels on the MBa8Xx is given, not considering the rise times of the voltages:...
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The 1.8 V supply for the components on the MBa8Xx is provided by default via pin X2-12 (V_1V8_OUT) of the TQMa8Xx. Alternatively, a 1.8 V voltage regulator can be used on the MBa8Xx via a mounting option. The following table shows the corresponding options.
Figure 25 shows the reset structure on the MBa8Xx. In addition to the reset signals of the TQMa8Xx, the MBa8Xx also provides further software-controlled reset signals for individual function blocks, e.g. ENET reset for the Ethernet transceivers. These are implemented by GPIO signals and named accordingly in the respective chapters when applicable.
The MBa8Xx has overall dimensions (length × width × height) of 170 × 170 × 27.1 mm³. The MBa8Xx has six 4.2 mm mounting holes for the housing, and three 2.7 mm mounting holes for a heat sink. The MBa8Xx weighs approximately 220 grams without TQMa8Xx.
Thermal management The greatest power dissipation on the MBa8Xx is caused by the voltage regulators. In addition, the TQMa8Xx is a heat source that acts indirectly on the MBa8Xx. Depending on the application, further power dissipation can occur, mainly at additional external loads on the pin headers on the MBa8Xx, the Mini PCIe slot, etc.
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TQMa8Xx must be taken into consideration when connecting the heat sink. The TQMa8Xx is not the highest component. Inadequate cooling connections can lead to overheating of the TQMa8Xx or the MBa8Xx and thus malfunction, deterioration or destruction.
Since the MBa8Xx is a development platform, no EMC tests have been performed. During the development of the MBa8Xx the standard DIN EN 55022:2010 limit class A was taken into account. ESD protection is provided on most interfaces of the MBa8Xx.
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the MBa8Xx, it is produced in such a way, that it can be easily repaired and disassembled. The energy consumption of this subassembly is minimised by suitable measures.
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