KE17Z MCUs extend Kinetis E family to dual TSI performance and broader scalability. Robust and dual TSI provides high-level stability and accuracy to customer's HMI system. 1 Msps ADC and FlexTimer help build a perfect solution for a simple BLDC motor control system. Following are the general features of the KE17Z series MCUs: ® ®...
Page 4
NXP Semiconductors Overview • Debugging and Programming Interface • Touch Sensing interface (TSI) • ADC Input Circuit • Digital GPIO and unused pin • General Board Layout Guidelines A general schematic example is shown in the following figure. Figure 1. X-KE17Z-TSI-EVB schematic example 1.1 Related documentation...
Page 5
NXP Semiconductors Overview Table 2. Related documentation (continued) Document Description Link/how to access Kinetis KE17Z/13Z/12Z with Provides information about electrical KE1xZP100M72SF1 up to 256 KB Flash Data Sheet characteristics, hardware design considerations, and ordering information AN5426 Hardware Explains Hardware Design Guidelines for...
NXP Semiconductors Chapter 2 Power Supply The power supply of KE17Z ranges from 2.7 V to 5.5 V, the detailed operating requirements are listed below. Note that the difference between VDD (digital power supply) and VDDA (analog power supply) cannot exceed 0.1 V, so it is recommended to connect VDD and VDDA directly in practice.
Page 7
NXP Semiconductors Power Supply KE17Z Hardware Developer's Guide, Rev. 0.1, 13 December 2021 User Guide 7 / 19...
NXP Semiconductors Chapter 3 Clock Module The KE17Z has the following clock sources: • Fast internal reference clock (FIRC): 48 MHz high-accuracy (up to ±1%) fast internal reference clock (FIRC) for normal Run as the default system clock source after reset.
Page 9
NXP Semiconductors Clock Module Figure 3. Crystal circuit design – Diagram 3 3.2 EMC considerations As the clock circuit is very sensitive to the noise, you need to pay attention to the following guidelines on PCB layout: Avoid placing any signal traces close to the clock circuit.
NXP Semiconductors Chapter 4 Reset Circuit Resetting the MCU provides a way to start processing from a known set of initial conditions. System reset begins with the on-chip regulator in full regulation and system clocking generation from an internal reference.
NXP Semiconductors Chapter 5 Debug and Programming Interface This MCU uses the standard Arm SWD interface protocol as shown in the following figure. While pull-up or pull-down resistors are not required ( has an internal pull-up and has an internal pull-down), external 10 kΩ pull resistors are...
NXP Semiconductors Chapter 6 Touch Sensing Input Touch sensing input (TSI) provides touch sensing detection on capacitive touch sensors. The external capacitive touch sensor is typically formed on PCB and the sensor electrodes are connected to TSI input channels through the I/O pins in the device.
Page 13
NXP Semiconductors Touch Sensing Input 6.3 PCB layout of the electrode shapes for TSI mutual capacitive mode The following figure is the recommended mutual key shape. Note that the number of fingers has much impact on the touch sensitivity. In general, more fingers result in stronger noise immunity but less touch sensitivity. Customer should select the right finger numbers for the thickness of touch overlay.
NXP Semiconductors Chapter 7 ADC Input Circuit Each ADC input must have an RC filter as shown in the following figure. The maximum value of the resistor must be less than R (maximum 5 kohm as shown in the table below) if fast sampling and high resolution are required. The value of C must be chosen to ensure that the RC time constant is very small compared to the sample period.
Page 15
NXP Semiconductors ADC Input Circuit Table 5. 12-bit ADC operating conditions (continued) Symbol Description Conditions Min. Typ. Max. Unit Notes ADC reference voltage high REFH 100m ADC reference voltage low − 100 REFL Input voltage — REFL REFH ADIN Source impedendance <...
NXP Semiconductors Chapter 8 Digital GPIO and Unused Pin For the detailed IO pin mux functions and pinout, see "Section 4 Pinouts" in KE1xZP100M72SF1, Kinetis KE17Z/13Z/12Z with up to 256 KB Flash Data Sheet. Regarding IO drive strength, there are 8 high drive pins with 20 mA drive strength. These high drive pins are: PTD0, PTD1, PTD15, PTD16, PTB4, PTB5, PTE0, and PTE1.
NXP Semiconductors Chapter 9 General Board Layout Guidelines For the detailed general board layout guidelines, see "Chapter 10" in AN5426, Hardware Design Guidelines for S32K1xx Microcontrollers. KE17Z Hardware Developer's Guide, Rev. 0.1, 13 December 2021 User Guide 17 / 19...
NXP Semiconductors Appendix A Revision History The table below summarizes the revisions to this document. Table 6. Revision history Topic cross-reference Revision Date Change description 13 December Overview Fixed cross-references 2021 9 December Initial public release 2021 KE17Z Hardware Developer's Guide, Rev. 0.1, 13 December 2021...
Page 19
Right to make changes - NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Need help?
Do you have a question about the KE17Z Series and is the answer not in the manual?
Questions and answers