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Remove the masking tape from the GPS module, and remove the masking tape holding
the board to your work surface. Turn the module over, and with two new pieces of masking
tape tack it down to your work surface so it will not move (yes, it will be upside-down).
You will now be soldering the eight square pads on the bottom of the GPS module to the PC
board. You will see that there are eight square pads with holes in the middle, these are aligned
with the square pads on the GPS module. What you are going to be doing is to flow solder
down those holes onto the pads, so that they are bonded to the board. Please read this
procedure carefully BEFORE you start soldering, it is important that you do not overheat the
pads on the GPS module.
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Melt some solder into the hole in the UPPER-LEFT PAD and hold the iron in the hole,
melting the solder so that it flows onto the GPS pad below. Keep the iron there for about 10
seconds; if the solder gets sucked down into the hole (which is a good thing because that means
that it's getting on the GPS pad below), add a little more. When you're satisfied that the solder
has melted onto the GPS pad, remove the iron and let the board cool for at least 30 seconds.
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Repeat the procedure for the other pads, numbered 2-8, in this order (the one that you
did before was pad #1). Wait 30 seconds between pads to allow the GPS module to cool down.
1
7
5
4
8
2
3
6
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