Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E32-900T30D User Manual

Chengdu Ebyte Electronic Technology Co., Ltd
The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the

lower the transmitting power.
Due to antenna quality or poor matching between antenna and module.
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9.2 Module is easy to damage

Please check the power supply source, ensure it is in right range.

Please check the stability of power source, the voltage cannot fluctuate too much.
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Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
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Please avoid using modules under too high or too low temperature.
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9.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
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The extension line and feeder quality are poor or too long, so the bit error rate is high;
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10 Production guidance

10.1 Reflow soldering temperature

Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Average ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Profile Feature Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
max 6 minutes
E32-900T30D User Manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
max 8 minutes
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