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Great care must be taken in replacing components on the cards. Special soldering
equipment suitable for use on the delicate solid-state components must be used
and, even then, care must be taken not to cause thermal damage to the
components, and not to damage or bridge over the p rinted circuit buses. The
repaired area must be coated with a suitable high-dielectric plastic coating to
prevent possi ble breakdowns across the printed-circuit buses due to moisture or
dust.
Dual in-line integrated circuits are especially difficult to remove and replace
without specialized equipment. Furt h ermore, many of these components are
used on printed-circuit cards that have bus runs on b oth sides. These additional
complications require ver y s p ecial soldering equipment and removal tools as well
as additional skills and trainmg, which must be considered before field repairs are
attempted.
When ordering renewal parts, address the nearest Sales Office of the General Electric
Since the last edition, Figures 20 and 21 have been revised.
GEK-65512
CAUTION:
ADDITIONAl CAUTION:
20
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