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15 HOW TO REPLACE FLAT PACKAGE IC
15.1. Preparation
· SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
· Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 W to 80 W iron, but beginner might damage foil by overheating.)
· Flux
HI115 Specific gravity 0.863.
(Original flux will be replaced daily.)
15.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
15.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
All manuals and user guides at all-guides.com
*Most important matter is accurate setting
of IC to the corresponding soldering foil.
39
KX-TC1468LBB
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