A
B
YSP-1000
1
I PRINTED CIRCUIT BOARD (Foil side)
DSP P.C.B. (Side A) Lead Free Solder Used
2
3
AMP (1)
(CB702)
AGND
WFL_OUT
AGND
DGND
D3_PROTN
/WF_MUTE
D3_MUTEN
D4_MOD0
DGND
YBWCK
4
YBBCK
DGND
YBSDO7
YBSDO6
DGND
YBSDO5
YBSDO4
DGND
YCWCK
YCBCK
DGND
YCSDO5
YCSDO4
DGND
YCSDO3
YCSDO2
DGND
YCSDO1
YCSDO0
DGND
5
6
7
48
C
D
INPUT (1)
(CB508)
1
5
1
5
105
104
28
54
27
1
48
25
53
52
1
24
OPERATION (4)
(CB302)
E
F
to MAIN U-COM
WRITER
INPUT (2)
(CB2)
C384
1
8
5
4
14
10
11
8
1
20
156
1
157
208
1
5
208
157
156
1
EMU1
TMS
EMU0
/TRST
DGND
TDI
TCK
PD(+3.3V)
TDO
TDO
PD(+3.3V)
TCK
TDI
DGND
/TRST
EMU0
TMS
EMU1
G
H
I
INPUT (2)
(CB3)
3
1
4
5
37
48
36
1
51
80
50
25
12
81
13
24
100
1
DGND
31
30
1
YASDO1
7
YASDO2
DGND
YASDO5
YABCK
DGND
YBSDO1
YBSDO2
DGND
24
1
YBWCK
52
D4_MOD0
53
/WF_MUTE
DGND
WFR_OUT
25
48
1
25
104
105
50
26
OPERATION (1)
(CB1)
• Semiconductor Location
Ref. No. Location Ref. No. Location Ref. No. Location
IC1
IC2
IC3
IC4
IC5
IC7
J
AMP (2)
(CB502)
YASDO0
DGND
YASDO3
YASDO4
DGND
YAWCK
YBSDO0
DGND
YBSDO3
YBBCK
DGND
D3_MUTEN
D3_PROTN
AGND
AGND
C4
IC8
F4
IC21
H3
C3
IC9
H5
IC25
F3
F5
IC11
H4
IC26
H3
G3
IC12
E5
G5
IC16
C5
G4
IC17
C5
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