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TABLE OF CONTENTS
6.
Circuit Boards Location ····················································· 3
6-8. Schematic Diagram - Main (2/2) Section - ··················· 4
6-9. Schematic Diagram - Main/Trans Section - ·················· 7
6-10. Printed Wiring Board -Main/Trans Section - ·············· 11
6-13. Printed Wiring Board - Power AMP Section - ············ 15
6-14. Schematic Diagram - Power AMP Section - ··············· 17
7.
EXPLODED VIEWS
(1)
Case, MD Assy Section ···················································· 19
(2)
Front Panel Section ·························································· 20
(3)
Chassis Section ································································· 21
8.
CAUTION
Use of control or adjustments or performance of procedures
other than those specified hereinmay result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
rear exterior.
Laser component in this product is capable of emitting radiation
exceeding th elimit for Class 1.
The following caution label is located inside the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
All manuals and user guides at all-guides.com
MODEL IDENTIFICATION
- BACK PANEL -
··································· 22
E
SP, MY, TH, AR
EA
•
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefor , when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
Note on chip component replacement
•
•
Flexible Circuit Board Repairing
•
•
•
- 2 -
MODEL
Abbreviation
EA
: Saudi Arabia
MY : Malaysia
SP
: Singapore
TH
: Thailand
AR
: Argentine
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Never reuse a disconnected chip component.
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Keep the temperature of the soldering iro around 270 ˚C during
repairing.
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Be careful not to apply force on the conductor whe soldering
or unsoldering.
PART NO.
4-993-650-01
4-993-650-21
4-993-650-31
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