LG -E400f Service Manual page 188

Level LocationNo.
Inductor
6 L903
Multilayer,Chip
C1044
Capacitor
6 C227
Ceramic,Chip
C910
6 BAT400 Capacitor Assembly
Capacitor
6 C229
TA,Conformal
C410
C411 Capacitor
6
C414 Ceramic,Chip
C702
6 U102 IC,Power Amplifier
C174 Capacitor,
6
C187 Ceramic,Chip
C412 Capacitor
6
C503 Ceramic,Chip
IC,Digital Baseband
6 U200
Processor,3G
6 D200 Diode,Switching
R217
6 R315 Resistor,Chip
R500
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
ELCH0003828
ECCH0000122
SMZY0023501
ECTH0001903
EAE62506501
SMPY0020702
ECCH0005603
ECCH0007803
EAN62405901
EAH61532901
ERHZ0000406
Spec
LQG15HS2N4S02D 2.4NH 0.3NH - 300mA
0.15OHM 6GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
MCH155A470JK 47pF 5% 50V NP0 -
55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION
PAS311HR-VG1 3.8 Backup Capacitor
0.03F,Module Assembly, KOREA TAIYO
YUDEN.CO., LTD.
F980J226MMA 22uF 20% 6.3V 1.4UA -
55TO+125C 8OHM 1.6X0.85X0.8MM NONE
SMD R/TP 0.9T max. NICHICON
CORPORATION, EAST JAPAN SALES OFFICE
CL05A475MP5NRNC 4.7uF 20% 10V X5R -
55TO+85C 1005 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
ACPM-5201-LR1
dBm,%,A,dBc,dB,3.0*3.0*1.1,SMD,WBAND
1,CPL,3 MODE,BYPASS
CLAMPING,SMD,R/TP, AVAGO
TECHNOLOGIES INTERNATIONAL SALES
PTE. LIMITED
GRM188R61A225K 2.2uF 10% 10V X5R -
55TO+85C 1608 R/TP - MURATA
MANUFACTURING CO.,LTD.
CL10A106MP8NNNC 10uF 20% 10V X5R -
55TO+85C 1608 R/TP 0.8MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
MSM7225A-1-AA
576NSP,ARMv7(800MHz),HSDPA(DL7.2Mbps
only), HVGA LCD, VGA30fps,5M,MIPI CSI_DSI
NSP R/TP 576P QUALCOMM
INCORPORATED.
BA891_ 1V 35V - - 0SEC 715mW SOD523 R/TP
2P 1 NXP Semiconductors
MCR01MZP5J104 100KOHM 5% 1/16W 1005
R/TP - ROHM.
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