Emerson Symphonic SC1304 Service Manual page 13

d. Preheating
Leadless capacitor must be preheated before
installation. (130°C~150°C, for about two minutes.)
Notes:
a. Leadless components must not be reused after
removal.
b. Excessive mechanical stress and rubbing for the
component electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers
and alternately apply heat to both electrodes. When
the solder on both electrodes has melted, remove
leadless component with a twisting motion.
Notes:
a. Do not attempt to lift the component off the board
until the component is completely disconnected
from the board by the twisting action.
b. Take care not to break the copper foil on the printed
board
3. Installing the leadless component
a. Presolder the contact points of the circuit board.
b. Press the part downward with tweezers and solder
both electrodes as shown below.
Note:
Do not glue the replacement leadless component to
the circuit board.
Chip
Soldering Iron
Tweezers
Tweezers
Soldering Iron
Solder
Presolder
How to Remove / Install Flat Pack IC
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not apply the hot air to the chip parts around the
Flat Pack-IC for over 6 seconds as damage may
occur to the chip parts. Put Masking Tape around
the Flat Pack-IC to protect other parts from dam-
age. (Fig. S-1-2)
3. The Flat Pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or solder lands under the IC when removing it.
1. Removal
With Hot - Air Flat Pack - IC Desoldering Machine:
a. Prepare the Hot - Air Flat Pack - IC Desoldering
Machine, then apply hot air to Flat Pack - IC (about
5~6 seconds). (Fig. S-1-1)
b. Remove the Flat Pack- IC with tweezers while
applying the hot air.
With Soldering Iron:
a. Using desoldering braid, remove the solder from all
pins of the Flat Pack - IC. When you use solder flux
which is applied to all pins of the Flat Pack - IC, you
can remove it easily. (Fig. S-1-3)
b. Lift each lead of the Flat Pack - IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air Desoldering
Machine. (Fig. S-1-4)
With Iron Wire:
a. Using desoldering braid, remove the solder from all
pins of the Flat Pack - IC. When you use solder flux
which is applied to all pins of the Flat Pack - IC, you
can remove it easily. (Fig. S-1-3)
b. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
c. Pull up on the wire as the solder melts so as to lift
the IC leads from the CBA contact pads, while
heating the pins using a fine tip soldering iron or
hot air blower.
1-3-2
Soldering Iron
SFTY_Z13N