Nokia NSW-6 Series Technical Documentation Manual page 64

NSW-6
System Module SE2
C918 2320939 Ceramic cap.
C919 2320921 Ceramic cap.
C920 2320536 Ceramic cap.
C921 2320552 Ceramic cap.
C922 2320552 Ceramic cap.
C923 2320530 Ceramic cap.
C931 2320520 Ceramic cap.
C932 2320629 Ceramic cap.
C934 2320552 Ceramic cap.
C937 2320552 Ceramic cap.
C938 2320536 Ceramic cap.
C939 2320552 Ceramic cap.
C941 2320544 Ceramic cap.
C943 2320552 Ceramic cap.
C949 2320522 Ceramic cap.
C950 2320536 Ceramic cap.
C951 2320584 Ceramic cap.
C952 2320536 Ceramic cap.
C953 2320536 Ceramic cap.
C960 2312401 Ceramic cap.
C961 2320560 Ceramic cap.
C962 2320544 Ceramic cap.
C963 2320481 Ceramic cap.
C965 2320903 Ceramic cap.
C966 2320903 Ceramic cap.
C967 2320532 Ceramic cap.
C968 2320536 Ceramic cap.
C969 2320805 Ceramic cap.
C981 2320520 Ceramic cap.
C982 2320560 Ceramic cap.
C983 2320536 Ceramic cap.
C984 2320536 Ceramic cap.
L701 3645213 Chip coil
0603
L702 3643039 Chip coil
0805
L703 3645241 Chip coil
0603
L705 3641626 Chip coil
0805
L721 3645249 Chip coil
0603
L723 3645157 Chip coil
0603
L724 3640701 Chip coil
1008
L740 3645231 Chip coil
0603
Page 64
E Nokia Mobile Phones Ltd.
PAMS Technical Documentation
16 V 0402
3.9 p 5 % 16 V 0402
10 p 5 % 50 V 0402
47 p 5 % 50 V 0402
47 p 5 % 50 V 0402
5.6 p 0.25 % 50 V 0402
2.2 p 0.25 % 50 V 0402
50 V 0402
47 p 5 % 50 V 0402
47 p 5 % 50 V 0402
10 p 5 % 50 V 0402
47 p 5 % 50 V 0402
22 p 5 % 50 V 0402
47 p 5 % 50 V 0402
2.7 p 0.25 % 50 V 0402
10 p 5 % 50 V 0402
1.0 n 5 % 50 V 0402
10 p 5 % 50 V 0402
10 p 5 % 50 V 0402
1.0 u 10 % 10 V 0805
100 p 5 % 50 V 0402
22 p 5 % 50 V 0402
5R 1 u 10 % 0603
2.7 p 5 % 16 V 0402
2.7 p 5 % 16 V 0402
6.8 p 0.25 % 50 V 0402
10 p 5 % 50 V 0402
100 n 10 % 10 V 0402
2.2 p 0.25 % 50 V 0402
100 p 5 % 50 V 0402
10 p 5 % 50 V 0402
10 p 5 % 50 V 0402
22 n 5 % Q=38/250 MHz
220 n 5 % Q=35/100 MHz
12 n 5 % Q=35/250 MHz
220 n 2 % Q=50/250 MHz
3 n 5 % Q=22/250 MHz
100 n 10 % Q=12/100 MHz
470 n 5 % Q=32/100 MHz
39 n 5 % Q=40/250 MHz
Issue 1 12/99