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,
,
i
with the hole.
Applying the iron for
more than four seconds at a time may dam-
age the chassis base material.
Remove as much
so~der
from the lead as
possible.
Remove all the kinks in the
wire.
With heat applied, gently pull
the wire through the hole.
2.
RESOLDERING THE COMPONENT LEAD
If the component is good, replace as fOl-
lows:
Use a metal twist drill
(1/8"
dia.
or less) to clear the hole only in the
fillet
pf
solder.
Turn with the fingers
only.
Remove solder slowly to prevent
the drill from tearing the fillet.
~
A~
bottom view
of chassis
Fig.
3 -
Cleaning
Ho~es
With the iron
app~ied
to the fillet, pull
the wire gently out of the component side
of the chassis:
£
pliers
~tiP
Fig" 4 - Removing Lead
Be sure the component lead is straight
and free of solder.
Push it gently back
thru the hole until
8011e
of
it
shows on
the other side.
SoJ..der carefully but
rapidly to prevent chassis damage.
3.
REPLACING COMPONENTS
Components can be replaced with less
chance of damage to the chassis than the
removal and rewiring of one of the leads.
Remove as follows:
Clip the leads close
to the body of the component.
Heat the
fillet and gently push the wire thIu un-
til the hook may be clipped off.
Clip
the hook off (on the soldered side) with
-6-
sharp cutters.
~
pliers
~
iron tip
Fig. 5 - Removing Components
After' removing the leads, pr'epar e the
chassis foT' the new component as explain-
ed in paragraph
2
and Fig. ?
To replace the component, fold the leads
on the new par't to the same spacing as
the mounting holes.
Insert the part and
fold the leads under the chassis to hold
the component firmly
aga~nst
it:
Rig. 6 - Installing New Component
Clip off the excess
~ire~
Place the iron
on both the component lead and fillet.
Solder carefully and rapidly to prevent
damage to the chassis base.
If one of
the conductors is damaged, it is seldom
necessary to scrap the printed chassiso
Lay a
smal~
piece of wire
(#18
to
24
ga.)
across the break and solder each end to
the conductor.
If the fillet is pulled loose, break it
off to get rid of the loose end.
Fold
the new component lead to lay on the con-
ductor and solder.
If the eomponent lead
is too Bhort, solder in another piece of
wire to
~ridge
the gap.
Printed chassis
construction places no IIlechcclical strain
on repairs of this nature, thus, solder-
ing alone will provide sufficient mechan-
ical strength even with heavy shock and
~ibration
in almost every case.
The base material used on the printed
chassis is the best available for this
service.
The two ounce copper is twice
as heavy as used in average
of this type of equipment.
reliable service and repair.
applications
This assures
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