Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E72-2G4M05S1F Manual

Chengdu Ebyte Electronic Technology Co.,Ltd.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;

The signal will be affected when the antenna is near metal object or put in a metal case;

Power register was set incorrectly,air data rate is set as too high (the higher the air data rate,the shorter the distance);

The power supply low voltage under room temperature is lower than recommended value, the lower the transmitting

power;
Due to antenna quality or poor matching between antenna and module.


6.2 Module is easy to damage

Please check the power supply source, ensure that it is within the recommended supply voltage, voltage higher than

the maximum value, will permanent damage the module;
Please check the stability of power source, the voltage cannot fluctuate too much;

Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility;

Please ensure the humidity is within limited range, some parts are sensitive to humidity;

Please avoid using modules under too high or too low temperature.


6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and

channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;

The extension line and feeder quality are poor or too long, so the bit error rate is high.


7 Production guidance

7.1 Reflow soldering temperature

Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
Profile Feature Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E72-2G4M05S1F User Manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
9