LAPIS Semiconductor ML7406 Hardware Design Manual
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LAPIS Semiconductor ML7406 Hardware Design Manual

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Dear customer
st
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd. ("LAPIS
Technology") and LAPIS Technology succeeded LAPIS Semiconductor's LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020

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Summary of Contents for LAPIS Semiconductor ML7406

  • Page 1 LAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPIS Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business. Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor" and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."...
  • Page 2 FEXL7406DG-01 ML7406 Family LSIs Hardware Design Manual Issue Date: Dec. 25 2018...
  • Page 3 Products. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.

  • Page 4: Introduction

    ML7406 Family LSIs Hardware Design Manual Introduction This hardware design manual contains hardware information that should be referenced when designing ML7406 family devices (Hereafter ML7406). And also contains the measurement conditions and example of measurement results of RF characteristics. Target product：...

  • Page 5: Notation

    ML7406 Family LSIs Hardware Design Manual Notation Classification Notation Description  Numeric value 0xnn Represents a hexadecimal number. 0bnnnn Represents a binary number.  Address 0xnnnn_nnnn Represents a hexadecimal number. (indicates 0xnnnnnnnn)  Unit word, W 1 word = 32 bits...

  • Page 6: Table Of Contents

    ML7406 Family LSIs Hardware Design Manual Table of Contents Introduction ..............................ii Notation ................................iii Table of Contents ............................. iv Placing decoupling capacitors ........................1 Clock Input ..............................3 2.1. Crystal Oscillator circuit [ML7406C] ....................3 2.1.1. Circuit component values for crystal oscillator circuit ............3 2.1.2.

  • Page 7: Placing Decoupling Capacitors

    ML7406 Family LSIs Hardware Design Manual 1. Placing decoupling capacitors Place decoupling capacitors between each power pins and GND as shown in Figure 1.1. PA_OUT(#20) L3*[1] REG_PA(#21) 100pF 1μF VDD_PA(#22) PA regulator 1000pF 0.1µF 10µF VDDIO(#9) 1000pF 0.1µF VDD_REG(#1) 1.5Vregulator 1000pF 0.1µF...
  • Page 8 CH (temperature compensating) or a B (high dielectric constant type) of temperature characteristics. 9. ML7406 support low power consumption mode (SLEEP MODE). In this mode, the consumption current of the LSI is around 0.9μA. Therefore the leak current of decoupling capacitors will impact on the consumption current of your specific circuit.

  • Page 9: Clock Input

    FCX-05 1.8 to 3.6 -40 to +85 NX2520SA 1.8 to 3.6 -40 to +85 [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board. FEXL7406DG-01...

  • Page 10: Notes On The Crystal Oscillator Circuit Configuration

    ML7406 Family LSIs Hardware Design Manual 2.1.2. Notes on the crystal oscillator circuit configuration Note the following when designing the crystal oscillator circuit. The capacitors value of C1 and C2 depends on the crystal oscillator specification. C1 and C2 should be placed as close as possible to the XIN (#5) and the XOUT (#6) pins to suppress parasitic LCR and stabilize the oscillator.

  • Page 11: Tcxo Circuit [Ml7406T]

    ML7406 Family LSIs Hardware Design Manual 2.2. TCXO circuit [ML7406T] Please use a TCXO that satisfy the following specification.  Output load: 10kΩ//10pF  Output level: 0.8Vpp to 1.5Vpp  Frequency accuracy: below ±20ppm The ML7406T has integrated bias circuit and the DC bias is applied to the TCXO (#6) pin. A 1000pF capacitor should be placed on the TCXO line as following.

  • Page 12: Pll Loop Filter

    ML7406 Family LSIs Hardware Design Manual 3. PLL loop filter Figure 3.1 shows a configuration example of the PLL loop filter circuit. To satisfy phase noise feature, the recommend values are showed in Figure 4.1. It is recommended to select the components with flat temperature characteristics and temperature coefficient is managed.

  • Page 13: Vco

    The L in the above equation will be the sum of the inductor L1, the line inductance of the PCB and the internal inductance of the ML7406. And the C will be the sum of the capacitor C1, the line capacitor of the PCB and the internal capacitor (including calibration capacitor) of the ML7406.

  • Page 14: Adjusting Component Values For Vco Tank

    It is recommended to evaluate these characteristics when L1 and C1 values is fixed. Table 4.1.1 Representative component values for operating frequency 868MHz band 4.7nH 4.3pF [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board. FEXL7406DG-01...

  • Page 15: Note On The Vco Tank Circuit

    90 degrees to avoid their coupling (Refer to Figure 4.2.2). 2.2. L1 and L3 or L2 should be placed close to their connect pins of ML7406. They should not be placed close to each other..
  • Page 16 ML7406 Family LSIs Hardware Design Manual L2 or L3 and L6 should be placed so that their positional relationship with the 90 degrees in order to avoid their coupling. Figure 4.2.2 Recommended placement of L1 and L2 or L3 FEXL7406DG-01...

  • Page 17: Rf Matching Component Values

    0dBm 34.35 – j112.6 Rx (LNA_P pin) [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board. 5.1. Transmission matching circuit Figure 6.1.1 shows the transmission maching circuit configuraltions. The REG_PA (#28) pin provides the DC bias to the PA_OUT(#27) pin.

  • Page 18: Reception Matching Circuit

    Blue line is 50Ω line 0.7pF 100pF LNA_P (#24) 13nH Figure 5.2.1 Reception matching circuit configurations [Note] These component values appropriate for use on the LAPIS Semiconductor’s RF board. It is not guaranteed to obtain same result on your specific board. FEXL7406DG-01...

  • Page 19: Antenna Switch

    Figure 6.1 Antenna switch circuit configurations for 2-diversity 7. Temperature measurement ML7406 has thermometer. When using the implemented thermometer, place a 75kΩ resister between A_MON (#23) pin and the ground.It is recommended to use a high accuracy resistor with well temperature characteristics.

  • Page 20: Notes On Selecting External Parts (Recommendations)

    ML7406 Family LSIs Hardware Design Manual 8. Notes on selecting external parts (recommendations)  Anntenna It is recommended to use an antenna with the specifications shown in Table 8.1. Select an antenna with the best directive characteristics for your specific operating, environmental and installation condition.

  • Page 21: Application Circuit

    [Note] About the peripheral parts of pin #5 and ·These component values are the reference value. LAPIS Semiconductor does not guarantee the values. #6, please refer the section 2. ·The XIN (#5) pin should be OPEN when using TCXO or SPXO.

  • Page 22: Bill Of Materials

    ML7406 Family LSIs Hardware Design Manual 11. Bill of Materials Component Value Vendor Remarks Murata Manufacturing Co., Ltd. LQW15AN or equivalent（1005） 4.7nH Murata Manufacturing Co., Ltd. LQW15AN or equivalent（1005） 13nH Murata Manufacturing Co., Ltd. LQW15AN or equivalent（1005） 4.1nH 3.6nH Murata Manufacturing Co., Ltd. LQW15AN or equivalent（1005）...
  • Page 23 River Eletec Corporation 26MHz Crystal Unit NX2520SA Nihon Denpa Kogyou Co., Ltd. 26MHz Crystal Unit *1: Please refer the Table 2.1.1 in the section 2.1. [Note] These component values are the reference value. LAPIS Semiconductor does not guarantee the evaluation result. FEXL7406DG-01...

  • Page 24: Revision History

    ML7406 Family LSIs Hardware Design Manual Revision history Page Document No. Date Content Previous – – FEXL7406DG-01 2018.12.25 The first edition FEXL7406DG-01...

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