Technical Reference; Layer 1 Specifications (Physical); Layer 2 Specifications (Mac/Rlc); Layer 3 Specifications (Rrc) - Huawei EM770 Product Specification

6.1 Layer 1 Specifications (Physical)

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6.2 Layer 2 Specifications (MAC/RLC)

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6.3 Layer 3 Specifications (RRC)

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6.4 Layer 3 NAS/Core Network (MM/CM)

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Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Issue 1
Required).It may not be duplicated, neither distributed externally without
(2008-09-15)
prior and written permission of Huawei.
Examples of Channel Coding and Multiplexing TR 25.944
Physical Layer–General Description TS 25.201
Physical Channels and Mapping of Transport Channels onto Physical Channels
(FDD) TS 25.211
Multiplexing and Channel Coding (FDD) TS 25.212
Spreading and Modulation (FDD) TS 25.213
Physical Layer–Procedures (FDD) TS 25.214
Physical Layer–Measurements (FDD) TS 25.215
3GPP HSPA overall description 25.308
3GPP UE radio access capabilities 25.306
MAC Protocol Specification TS 25.321
RLC Protocol Specification TS 25.322
UE Interlayer Procedures in Connected Mode TS 25.303
UE Procedures in Idle Mode TS 25.304
RRC Protocol Specification TS 25.331
Architectural Requirements for Release 1999 TS 23.121
NAS Functions Related to Mobile Station (MS) in Idle Mode TS 23.122
Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
HUAWEI EM770 HSPA PC Embedded Module V100R001
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Technical Reference

Product Specification
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