Reliability; Temperature - Huawei EM770 Product Specification

2.2 Reliability

Table 2-1 Requirements on the environment reliability
Test Case
Environment
reliability

2.3 Temperature

Description
Operating temperature
Storage temperature
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Issue 1
Required).It may not be duplicated, neither distributed externally without
(2008-09-15)
prior and written permission of Huawei.
HUAWEI EM770 HSPA PC Embedded Module V100R001
High temperature
High temperature
Operational Random vibration
Shock vibration
Sine sweep vibration
High temperature
Low temperature
Damp heat, cyclic
Non-
Thermal shock
operational
Salt-fog
Drop
Durability
Minimum
–10
–40
Product Specification
Standard
IEC60068-2-2
IEC60068-2-1
MIL-STD-810F
-METHOD 514.5
ANSI/TIA-603-C-2004 -3.3.5
ANSI/TIA-603-C-2004 -3.3.4
IEC60068-2-2
IEC60068-2-1
IEC60068-2-30
IEC60068-2-14
IEC60068-2-11
IEC 60068-2-32
EIA-364-9
Maximum Unit
℃
+55
℃
+85
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