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C-Series
Low Noise, Fast, Blue-Sensitive Silicon Photomultipliers
USER MANUAL
C-Series: Low Noise, Fast, Blue-Sensitive Silicon Photomultipliers

Overview

The C-Series SiPM sensors from SensL are based on a P-on-N diode
structure (Figure 1) that results in a high PDE (Photon Detection Efficiency)
and sensitivity into the UV.
All C-Series SiPM sensors also feature SensL's proprietary fast output
terminal (Figure 2), giving access to signals with extremely fast rise times
and short pulse widths.
C-Series SiPM products are available in either MicroSC (2-pin) or MicroFC
(3-pin) versions.
Figure 2, Simplified microcell level
schematic of the C-Series SiPM.
SensL's C-Series low-light sensors feature an industry-leading low dark-count rate,
combined with high PDE and are available with SensL's proprietary fast mode output.
Three sensor sizes are available; 1mm, 3mm and 6mm packaged in a variety of formats
including TO-can, ceramic header and 4-side tileable surface mount technology (SMT)
package. In addition, two evaluation boards are available with pre-mounted SMT
sensors to facilitate rapid product evaluation.
This User Manual covers all aspects of using and understanding the C-Series range of
sensors and evaluation boards. More details on the performance characteristics of the
C-Series sensors can be found in the
SensL © 2014
C-Series
datasheet.
Figure 1, P-on-N sensor structure
MicroSC
Although all C-Series SiPM sensors have the architecture
shown in Figure 2, MicroSC packaged products only
have two pins giving access to the anode and cathode.
The fast output is not accessible in MicroSC products.
MicroFC
MicroFC packaged products have three (or more) pins,
giving access to the fast output as well as the anode
and cathode. The fast output is the derivative of the
internal fast switching of the microcell in response to the
detection of a single photon.
C-Series
1

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Summary of Contents for sensl C Series

  • Page 1: Overview

    C-Series: Low Noise, Fast, Blue-Sensitive Silicon Photomultipliers SensL’s C-Series low-light sensors feature an industry-leading low dark-count rate, combined with high PDE and are available with SensL’s proprietary fast mode output. Three sensor sizes are available; 1mm, 3mm and 6mm packaged in a variety of formats including TO-can, ceramic header and 4-side tileable surface mount technology (SMT) package.
  • Page 2: Table Of Contents

    Safe Handling of Sensors........................12 Package Summary ..........................12 SMT Package .............................13 X18 Package ............................14 X13 Package ............................14 ‘Not Connected’ (NC) Pads and Pins ....................14 Further Help ..............................15 Appendix A - Biasing Alternatives & Signal Polarity ..................16 SensL © 2014 SensL © 2014...
  • Page 3: Glossary

    Fast mode - Using the fast output signal from an FC product for improved timing or photon counting applications. Standard mode - Using the signal from the anode and cathode for the readout of an SC or FC product where timing performance is less critical. SensL © 2014 SensL © 2014...
  • Page 4: Biasing And Readout

    Mini-Circuits ZX60-43S+ be used. For photon counting applications it is recommended that the Mini-Circuits ZFL-1000LN+ be used. For PET applications it is possible to obtain both timing and energy resolution information from the fast output, with the anode and cathode only used for biasing. SensL © 2014 SensL © 2014...
  • Page 5 Figure 6, Recommended fast SiPM readout circuitry for 1mm MicroFC sensors. Figure 7, Recommended fast SiPM readout circuitry for 3mm and 6mm MicroFC sensors. Also shown is the recommended transformer part number and pin-out labelling. SensL © 2014 SensL © 2014...
  • Page 6: Standard Mode Biasing And Readout Of C-Series Sensors

    For applications that do not require fast timing from the MicroFC, or for the MicroSC products that do not give access to the fast output signal, SensL’s C-Series sensors will perform as a conventional SiPM. For MicroFC products the fast output terminal can be left open with no detriment to its standard mode performance. Standard mode signals may be more suitable for applications involving slow pulses or slowly-varying, continuous light levels, such as in luminometers or for gamma-ray spectroscopy with slow or low-light scintillators.
  • Page 7: Dual Mode Readout Of Microfc Sensors

    The standard output is amplified through a transimpedance amplifier (TIA). Figure 12, AC coupled readout option. DC information from the SiPM is lost but the pulse amplitude is maintained through the transimpedance amplifier (TIA). SensL © 2014 SensL © 2014...
  • Page 8: Readout Of Arrays Of Sipm Devices

    The decoupling capacitor from the cathode to 0V is critical to provide a return path for the fast output. This circuit is used on the SensL -SMA and -SMTPA evaluation boards. SensL recommend the -Vbias readout options from Figures 11 and 12 for most system designs.
  • Page 9: C-Series Mounted Sensors

    Table 1 summarizes the connections to the SMA board. Each board has two mounting holes to allow secure placement during testing, with sensors located at the edge of the board. This allows two sensors to be placed in close proximity for coincidence timing measurements. SensL © 2014 SensL © 2014...
  • Page 10: Microfc-Smtpa

    For evaluations where the timing performance of the fast output is critical, the use of the SMA board is recommended. The connectors from Samtec used are: BBL-103-G-E BBL-102-G-E Compatible sockets from Samtec are: SL-103-G-10 SL-102-G-10 SensL © 2014 SensL © 2014...
  • Page 11: Cad And Solder Footprint Files

    MicroFC-100XX-X18 CAD: Please refer to the package drawings in the C-Series datasheet MicroFC-300XX-X13 CAD: Please refer to the package drawings in the C-Series datasheet MicroFC-600XX-X13 CAD: Please refer to the package drawings in the C-Series datasheet SensL © 2014 SensL © 2014...
  • Page 12: Handling And Soldering

    Table 3, Summary of which package types are associated with which product type. * See Table 4 for definition ** Sensors shipped in either a waffle pack (WP) or gel pack (GP) require a bake according to J-STD-20, prior to reflow soldering SensL © 2014 SensL © 2014...
  • Page 13: Smt Package

    C with humidity below 90%RH. After the MBB has been opened, the devices must be reflow soldered within a period of time depending on the moisture sensitivity level (MSL). SensL SMT Tape & Reel are MSL 3, cut tape SMT are MSL 4 and SMT sensors shipped in trays require a bake prior to reflow soldering.
  • Page 14: X18 Package

    ‘Not Connected’ (NC) Pads and Pins Common PCB design practice is to ground any floating pins or pads such as those labelled ‘NC’. Grounding the pin helps shielding and can reduce noise interference from external sources (EMI/RF). SensL © 2014 SensL © 2014...
  • Page 15: Further Help

    C-Series Low Noise, Fast, Blue-Sensitive Silicon Photomultipliers USER MANUAL Further Help If more help is required in the set-up or operation of C-Series sensors, there are several SensL resources that can help. • The C-Series Datasheet contains more detailed information on the physical and performance characteristics of the sensors.
  • Page 16: Appendix A - Biasing Alternatives & Signal Polarity

    = quench resistor (included on the SiPM die) www.sensl.com sales@sensl.com +353 21 240 7110 (International) +1 650 641 3278 (North America) All specifications are subject to change without notice Rev. 2.0 March 2017 SensL © 2014 SensL © 2014 SensL © 2014...

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