sensl J Series User Manual

ArrayJ
USER MANUAL
ArrayJ - High Fill-Factor Arrays of J-Series SiPM Sensors
SensL's range of J-Series SiPM sensors have been used
to create high fill-factor, scaleable arrays. The sensors are
mounted onto PCB boards with minimal dead space, forming
arrays with industry-leading fill factor of up to 90%.
The back of each ArrayJ has either one or more multi-way
connectors, or a BGA (ball grid array). These allow access to
the fast output* and standard I/O from each pixel in the array,
and a common I/O from the summed substrates of the pixels.
The ArrayJ products with connectors can be used to interface
with the user's own readout via a mating connector, or to a
SensL Breakout Board (BOB). The BOBs allow for easy ac-
cess to the pixel signals and performance evaluation of the
arrays.
ArrayJ products with the BGA can be reflow soldered to the
user's readout boards, or purchased ready-mounted on a
pinned PCB evaluation board for easy testing. A BGA ArrayJ
cannot be removed from it's PCB evaluation board. This con-
trasts with an ArrayJ with connectors, as multiple arrays can
be evaluated with a single BOB.

ARRAYJ INPUTS AND OUTPUTS (I/O)

Figure 1 summarizes the array schematic for a portion of an
ArrayJ. Each SiPM sensor in the array has three electrical con-
nections: fast output, standard output and common.
The substrates (cathodes) of all sensors are summed together
to form the common I/O.
Each individual fast output and standard I/O (anode) are rout-
ed to its own output pin.
The pixel-level performance of the sensors in the array can be
found in the J-Series datasheet.
* The fast output is not available on the 2x2 array (ArrayJ-60035-4P).
Figure 1, Signal connections at the pixel level on the ArrayJ

ATTENTION!

Great care should be taken when disconnecting the
ArrayJ PCBs from the mating connectors, either on one
of the BOBs, or the user's own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from
the connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Note that a BGA ArrayJ cannot be removed from its EVB.
Use of Scintillators with the ArrayJ Products
Please consult the Tech Note on the use of scintillators
with the TSV arrays, which can be downloaded here.
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products.