Telit Wireless Solutions ME910G1 Series Design Manual
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Telit Wireless Solutions ME910G1 Series Design Manual

Telit Wireless Solutions ME910G1 Series Design Manual

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ME910G1
HW Design Guide
1VV0301593 Rev. 3 – 2020-03-24
Mod. 0805 2016-08 Rev.5

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Summary of Contents for Telit Wireless Solutions ME910G1 Series

  • Page 1 ME910G1 HW Design Guide 1VV0301593 Rev. 3 – 2020-03-24 Mod. 0805 2016-08 Rev.5...

  • Page 2: Notice

    ME910G1 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.

  • Page 3: Usage And Disclosure Restrictions

    ME910G1 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 4: Applicability Table

    ME910G1 HW Design Guide APPLICABILITY TABLE PRODUCTS ME910G1-W1 ME910G1-WW 1VV0301593 Rev.3 Page 4 of 97 2020-03-24...

  • Page 5: Table Of Contents

    ME910G1 HW Design Guide Contents NOTICE COPYRIGHTS ....................2 COMPUTER SOFTWARE COPYRIGHTS ............2 USAGE AND DISCLOSURE RESTRICTIONS ..........3 License Agreements ..............3 Copyrighted Materials ..............3 III. High Risk Materials ............... 3 Trademarks .................. 3 Third Party Rights ................. 3 APPLICABILITY TABLE ................
  • Page 6 ME910G1 HW Design Guide PINS ALLOCATION ..............17 Pin-out ..................17 LGA Pads Layout ................ 27 POWER SUPPLY ............... 28 Power Supply Requirements ............28 Power Consumption ..............30 General Design Rules ..............31 4.3.1. Electrical Design Guidelines of the power supply ......31 4.3.1.1.
  • Page 7 ME910G1 HW Design Guide RF SECTION ................61 Bands Variants ................61 TX Output power ................. 61 RX Sensitivity ................61 Antenna requirements..............61 6.4.1. PCB Design guidelines ............... 62 6.4.2. PCB Guidelines in case of FCC Certification ......63 6.4.2.1.
  • Page 8 ME910G1 HW Design Guide Carrier Tape detail ..............83 Reel detail ................... 84 Packaging detail ................. 85 Moisture sensitivity ..............85 CONFORMITY ASSESSMENT ISSUES ........86 Approvals..................86 SAFETY RECOMMENDATIONS..........93 READ CAREFULLY ..............93 ACRONYMS ................94 DOCUMENT HISTORY .............. 96 1VV0301593 Rev.3 Page 8 of 97 2020-03-24...

  • Page 9: Introduction

    ME910G1 HW Design Guide 1. INTRODUCTION Scope Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910G1 module. Audience This document is intended for Telit customers, who are integrators, about to implement their applications using our ME910G1 modules.

  • Page 10: Text Conventions

    ME910G1 HW Design Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction.

  • Page 11: General Product Description

    ME910G1 HW Design Guide GENERAL PRODUCT DESCRIPTION Overview The ME910G1 module is a CATM / NBIoT communication product which allows integrators to plan on availability for even the longest lifecycle applications, highly recommended for new designs specified for coverage worldwide. The product is fully voice capable, the digital audio interfaces make it suitable for applications such as voice enabled alarm panels, mHealth patient monitors and specialty phones such as those for the elderly or sensory-impaired.

  • Page 12: Target Market

    ME910G1 HW Design Guide Target Market ME910G1 can used telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: • Telematics services • Road pricing • Pay-as-you-drive insurance • Stolen vehicles tracking • Internet connectivity Main features Function Features...

  • Page 13: Me910G1-Ww

    ME910G1 HW Design Guide 2.5.2. ME910G1-WW RF power (dBm) Band Mode Class 850/900MHz 33 (+-2dB) 1800/1900MHz DCS/PCS 30 (+-2dB) B1, B2, B3, B4, B5, B8, B12, (LTE) CAT- B13, B18, B19, B20, B25, B26, 23 (+-2dB) B27, B28, B66, B85 B1, B2, B3, B4, B5, B8, B12, (LTE) CAT- B13, B18, B19, B20, B25, B26,...
  • Page 14 ME910G1 HW Design Guide CAT M1 / Band18 -108.0 -102.3 CAT M1 / Band19 -108.0 -102.3 CAT M1 / Band20 -107.8 -99.8 CAT M1 / Band25 -108.0 CAT M1 / Band26 -108.0 -100.3 CAT M1 / Band27 -108.0 -100.8 CAT M1 / Band28 -107.9 -100.8 CAT M1 / Band66...
  • Page 15 ME910G1 HW Design Guide CAT NB2 / Band19 -116.8 -108.2 CAT NB2 / Band20 -116.6 -108.2 CAT NB2 / Band25 -116.8 CAT NB2 / Band26 -116.8 -108.2 CAT NB2 / Band28 -116.9 -108.2 CAT NB2 / Band66 -116.6 -108.2 CAT NB2 / Band71 -115.4 CAT NB2 / Band85 -116.8...

  • Page 16: Mechanical Specifications

    ME910G1 HW Design Guide Mechanical Specifications 2.7.1. Dimensions The overall dimensions of ME910G1-W1 and ME910G1-WW are: • Length: 28.2 mm • Width: 28.2 mm • Thickness: 2.4 mm 2.7.2. Weight This information will be available in a next document revision. Temperature Range Note The module is fully functional(*)

  • Page 17: Pins Allocation

    ME910G1 HW Design Guide 3. PINS ALLOCATION Pin-out Signal Function Type Comment USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data) USB_D+ USB differential Data (+) USB_D- USB differential Data (-) VUSB Enable pin for the internal 5 / 3V Internal PD (100K) USB transceiver.
  • Page 18 ME910G1 HW Design Guide SIM Card Interface External SIM signal – SIMCLK 1.8V Clock External SIM signal – SIMRST 1.8V Reset External SIM signal – SIMIO 1.8V Data I/O External SIM signal – Internal PU SIMIN CMOS 1.8 Presence (active low) (470K) External SIM signal –...
  • Page 19 ME910G1 HW Design Guide DIGITAL IO STAT LED is alternate function GPIO_01 GPIO_01 /STAT LED CMOS 1.8V internal PD (100K) internal PD GPIO_02 GPIO_02 CMOS 1.8V (100K) internal PD GPIO_03 GPIO_03 CMOS 1.8V (100K) internal PD GPIO_04 GPIO_04 CMOS 1.8V (100K) internal PD GPIO_05...
  • Page 20 ME910G1 HW Design Guide LTE Antenna ANTENNA (50 ohm) GNSS Section GNSS Antenna ANT_GNSS (50 ohm) External GNSS LNA GNSS_LNA_EN CMOS 1.8V Enable Miscellaneous Functions HW Unconditional HW_SHUTDOWN* VBATT Active low Shutdown Input command for power ON_OFF*/WAKE* ON and to wake from deep 1.8V Active low sleep mode...
  • Page 21 ME910G1 HW Design Guide Main power supply (Radio VBATT_PA Power Main power supply (Radio VBATT_PA Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground...
  • Page 22 ME910G1 HW Design Guide Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground Power Ground...
  • Page 23 ME910G1 HW Design Guide RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED...
  • Page 24 ME910G1 HW Design Guide RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED...
  • Page 25 ME910G1 HW Design Guide RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 1VV0301593 Rev.3...
  • Page 26 ME910G1 HW Design Guide WARNING: Reserved pins must not be connected. Only D13-E13 pins can be connected together in order to be compatible with HE910 module. All pull-up (PU) and pull-down (PD) are about 100K 1VV0301593 Rev.3 Page 26 of 97 2020-03-24...

  • Page 27: Lga Pads Layout

    ME910G1 HW Design Guide LGA Pads Layout TOP VIEW ADC_IN1 VBATT VBATT_PA VBATT_PA VBATT VBATT_PA VBATT_PA SIMVCC SIMIN SIMIO SIMCLK DVI_RX GNSS_LNA SIMRST DVI_TX DVI_CLK GPIO_01 DVI_WA0 GPIO_02 ANT_GNSS GPIO_03 VAUX/PWR GPIO_04 ON_OFF*/ GPIO_06 WAKE* HW_SHUT VUSB GPIO_07 DOWN* FORCE_U GPIO_05 SPI_CS C105/RTS...

  • Page 28: Power Supply

    ME910G1 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. Power Supply Requirements The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements:...
  • Page 29 ME910G1 HW Design Guide NOTE: The Operating Voltage Range MUST never be exceeded; care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. If the voltage drop is exceeding the limits it could cause an unintentional power off of ME910G1 module.

  • Page 30: Power Consumption

    ME910G1 HW Design Guide Power Consumption Preliminary data Measure Mode Description Mode CATM NBIoT IDLE MODE Typical Typical (mA) (mA) AT+CFUN=1 Normal mode: full functionality of the module Disabled TX and RX; module is not AT+CFUN=4 registered on the network 0.98* 0.87* Paging cycle #256 frames (2.56s DRx cycle)

  • Page 31: General Design Rules

    ME910G1 HW Design Guide ** PSM in between eDRX *** Measurements available in a next document revision NOTE: The reported LTE CAT M1 and LTE CAT NB1 values are an average among all the product variants and bands for each network wireless technology.

  • Page 32: Source Power Supply Design Guidelines

    ME910G1 HW Design Guide • A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suited. • Make sure the low ESR capacitor on the power supply output rated at least 10V. An example of linear regulator with 5V input is: Guidelines 4.3.1.2.

  • Page 33: Battery Source Power Supply Design Guidelines

    ME910G1 HW Design Guide • Make sure the low ESR capacitor on the power supply output is rated at least 10V. • For Car applications a spike protection diode should be inserted close to the power input, in order to clean the supply from spikes. An example of switching regulator with 12V input is in the below schematic: 4.3.1.3.

  • Page 34: Thermal Design Guidelines

    ME910G1 HW Design Guide NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with ME910G1. Their use can lead to overvoltage on the ME910G1 and damage it. USE ONLY Li-Ion battery types. 4.3.2. Thermal Design Guidelines Worst case as reference values for thermal design of ME910G1 are: •...
  • Page 35 ME910G1 HW Design Guide ME910G1 is wide enough to ensure a voltage dropless connection even during an 0.6 A (LTE) or 2A (GSM) current peak. • The protection diode must be placed close to the input connector where the power source is drained.
  • Page 36 ME910G1 HW Design Guide 1VV0301593 Rev.3 Page 36 of 97 2020-03-24...

  • Page 37: Vaux Power Output

    ME910G1 HW Design Guide VAUX Power Output A regulated power supply output is provided in order to supply small devices from the module, like: level translators, audio codec, sensors, and others. Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command.

  • Page 38: Digital Section

    ME910G1 HW Design Guide 5. DIGITAL SECTION ME910G1 has four main operation states: OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state. ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected.

  • Page 39: Power On

    ME910G1 HW Design Guide Power On To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired.
  • Page 40 ME910G1 HW Design Guide A flow chart showing the proper turn on procedure is displayed below: “Modem ON Proc” START VBATT>VBATT PWRMON=ON ON_OFF*/WAKE* = LOW GO TO “HW Shutdown Delay = 5 sec (see note Unconditional” below) ON_OFF*/WAKE*= HIGH PWRMON=ON Delay = 1 sec GO TO “Start AT Commands””...
  • Page 41 ME910G1 HW Design Guide A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD” START Delay = 300 msec Enter AT <CR> GO TO AT answer in “HW Shutdown 1 sec ? Unconditional” GO TO “Start AT CMD”...
  • Page 42 ME910G1 HW Design Guide For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button: 1VV0301593 Rev.3 Page 42 of 97...

  • Page 43: Power Off

    ME910G1 HW Design Guide WARNING It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V. In case this condition it is not satisfied you could use the HW_SHUTDOWN* line to recover it and then restart the power on activity using the ON_OFF*/WAKE* line.
  • Page 44 ME910G1 HW Design Guide WARNING: Not following the recommended shut-down procedures might damage the device and consequently void the warranty. The following flow chart shows the proper turn off procedure: “Modem OFF Proc.” START PWRMON=O OFF Mode ON_OFF*/WAKE* = LOW Delay >= 3 sec AT#SHDN ON_OFF*/WAKE* = HIGH...

  • Page 45: Wake From Deep Sleep Mode

    ME910G1 HW Design Guide Wake from deep sleep mode ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wake- up time. Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds.
  • Page 46 ME910G1 HW Design Guide WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. It shall be kept as an emergency exit procedure. A typical circuit is the following: For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): 1VV0301593 Rev.3...
  • Page 47 ME910G1 HW Design Guide In the following flow chart is detailed the proper restart procedure: NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF transition.

  • Page 48: Fast Power Down

    Fast Shut Down feature permits to reduce the current consumption and the time-to- poweroff to minimum values. NOTE: Refer to ME910G1 series AT command reference guide (Fast power down - #FASTSHDN) in order to set up detailed AT command. 1VV0301593 Rev.3...

  • Page 49: Fast Shut Down By Hardware

    ME910G1 HW Design Guide 5.6.1. Fast Shut Down by Hardware The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO commands fast power down. Example circuit: NOTE: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown.

  • Page 50: Communication Ports

    ME910G1 HW Design Guide Communication ports 5.7.1. USB 2.0 HS The ME910G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table is listing the available signals: Signal Function NOTE USB_D+ USB differential Data (+) USB_D- USB differential Data (-) Accepted range: Power sense for the internal VUSB...

  • Page 51: Spi

    1.8V CMOS SPI_CS SPI Chip Select 1.8V NOTE: Due to the shared functions, SPI port and TX_AUX/RX_AUX port cannot be used simultanously. Refer to ME910G1 series AT command reference guide for port configuration. 1VV0301593 Rev.3 Page 51 of 97 2020-03-24...

  • Page 52: Serial Ports

    ME910G1 HW Design Guide SPI Connections SPI_MISO SPI_MOSI Application SPI_CLK Processor ME910G1 SPI_CS 5.7.3. Serial Ports The ME910G1 module is provided with by 2 Asynchronous serial ports: • MODEM SERIAL PORT 1 (Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: •...
  • Page 53 ME910G1 HW Design Guide RS232 Signal Name Usage Output from the ME910G1 that C109/DCD Data Carrier Detect indicates the carrier presence Transmit line *see Output transmit line of ME910G1 C104/RXD Note UART Receive line *see Input receive of the ME910G1 C103/TXD Note UART...

  • Page 54: Modem Serial Port 2

    ME910G1 HW Design Guide NOTE: According to V.24, some signal names are referred to the application side, therefore on the ME910G1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD)

  • Page 55: Rs232 Level Translation

    HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for port configuration. 5.7.3.3. RS232 level translation In order to interface the ME910G1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required.

  • Page 56: General Purpose I/O

    ME910G1 HW Design Guide • 3 receivers An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1.8V to the RS232 levels (Example done on 4 signals only).

  • Page 57: Using A Gpio As Input

    ME910G1 HW Design Guide The following table shows the available GPIO on the ME910G1: Signal Output Default State NOTE Drive Strength Alternate function INPUT – PD (100K) GPIO_01 STAT LED INPUT – PD (100K) GPIO_02 INPUT – PD (100K) GPIO_03 INPUT –...

  • Page 58: Using A Gpio As Output

    HIGH logic level signal applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for GPIO pins configuration. 5.8.2. Using a GPIO as OUTPUT The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or...

  • Page 59: External Sim Holder

    ME910G1 HW Design Guide It depends on the event that triggers the Registered in idle + power saving wakeup (In sync with network paging) Connecting Blinking 1 sec on + 2 sec off The reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type. : External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
  • Page 60 ME910G1 HW Design Guide Item Typical Unit Input Voltage range Volt AD conversion bits Input Resistance Mohm Input Capacitance The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function.

  • Page 61: Rf Section

    ME910G1 HW Design Guide 6. RF SECTION Bands Variants See section 2.2. TX Output power See section 2.5. RX Sensitivity See section 2.6. Antenna requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design.

  • Page 62: Pcb Design Guidelines

    ME910G1 HW Design Guide 81 MHz in LTE Band 71 48 MHz in LTE Band 85 Impedance 50 ohm ME310G1-W1: > 24dBm Average power Input power ME310G1-WW: > 33dBm Average power ≤ 10:1 (limit to avoid permanent damage) VSWR absolute max ≤...

  • Page 63: Pcb Guidelines In Case Of Fcc Certification

    ME910G1 HW Design Guide • If a Ground plane is required in line geometry, that plane has to be continuous and sufficiently extended, so the geometry can be as similar as possible to the related canonical model; • Keep, if possible, at least one layer of the PCB used only for the Ground plane; If possible, use this layer as reference Ground plane for the transmission line;...

  • Page 64: Transmission Line Design

    ME910G1 HW Design Guide 6.4.2.1. Transmission line design During the design of the ME910G1 interface board, the placement of components has been chosen properly, in order to keep the line length as short as possible, thus leading to lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case.

  • Page 65: Transmission Line Measurements

    ME910G1 HW Design Guide 6.4.2.2. Transmission Line Measurements An HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated coaxial cable has been soldered at the pad corresponding to RF output; a SMA connector has been soldered to the board in order to characterize the losses of the transmission line including the connector itself.
  • Page 66 ME910G1 HW Design Guide Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is shown in the following figure: Insertion Loss of G-CPW line plus SMA connector is shown below: 1VV0301593 Rev.3 Page 66 of 97 2020-03-24...

  • Page 67: Antenna Installation Guidelines

    ME910G1 HW Design Guide 6.4.2.3. Antenna Installation Guidelines • Install the antenna in a place covered by the LTE signal with CAT-M1 support. • Antenna must not be installed inside metal cases • Antenna must not be installed according Antenna manufacturer instructions •...

  • Page 68: Audio Section

    ME910G1 HW Design Guide 7. AUDIO SECTION The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I S serial bus interface standard. The audio port can be connected to end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed). Electrical Characteristics The product is providing the DVI on the following pins: Signal...

  • Page 69: Gnss Section

    ME910G1 HW Design Guide GNSS SECTION ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Signal Function...

  • Page 70: Gnss Antenna Requirements

    ME910G1 HW Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. 8.3.1. GNSS Antenna specification Item Value Frequency range 1559.0 ~ 1610.0 MHz Gain 20 ~ 30dB Impedance 50 ohm Noise Figure of LNA <...

  • Page 71: Gnss Characteristics

    ME910G1 HW Design Guide Be aware of max bias current in case of unwanted short on antenna cable, decoupling inductor may be demaged. In case of LNA with 1.8V supply, VAUX/POWERMON pin can be used to supply active GNSS antenna GNSS Characteristics This information will be available in a next document revision.

  • Page 72: Mechanical Design

    ME910G1 HW Design Guide 9. MECHANICAL DESIGN Drawing PIN B1 Lead Free Alloy: Surface Finishing Ni/Au for all solder pads Dimensions in 1VV0301593 Rev.3 Page 72 of 97 2020-03-24...

  • Page 73: Application Pcb Design

    ME910G1 HW Design Guide APPLICATION PCB DESIGN The ME910G1 modules have been designed in order to be compliant with a standard lead- free SMT process Recommended footprint for the application TOP VIEW 1VV0301593 Rev.3 Page 73 of 97 2020-03-24...
  • Page 74 ME910G1 HW Design Guide Solder resist pattern (dimensions in mm) Top Transparent View 1VV0301593 Rev.3 Page 74 of 97 2020-03-24...

  • Page 75: Pcb Pad Design

    ME910G1 HW Design Guide In order to easily rework the ME910G1 is suggested to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.

  • Page 76: Recommendations For Pcb Pad Dimensions

    ME910G1 HW Design Guide Recommendations for PCB pad dimensions It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes.

  • Page 77: Thermal Performance

    ME910G1 HW Design Guide Thermal performance FR4 is one of the most commonly used PCB materials, it is a flame retardant composite material, composed by fiberglass-reinforced and epoxy laminate. One of the features of the FR4, is to have a very low thermal conductivity. An inexpensive way to improve thermal transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between conductive layers.

  • Page 78: Solder Paste

    ME910G1 HW Design Guide The stencil should be made from stainless steel and the apertures layout can be the same of the recommended footprint (1:1). The recommended thickness shall be 127 um (5 mil). A stencil thickness of 152 µm (6 mil) can be used as well. Solder paste Various types and grades of solder paste can be used for surface mounting Telit modules.
  • Page 79 ME910G1 HW Design Guide – Temperature (TL) 217°C – Time (tL) 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak 10-30 seconds Temperature (tp) Ramp-down Rate 6°C/second max. Time 25°C to Peak Temperature 8 minutes max. NOTE: All temperatures refer to topside of the package, measured on the package body surface...

  • Page 80: Inspection

    ME910G1 HW Design Guide Inspection An inspection of the solder joint between the solder pads of the Telit module and the application PCB should be performed. The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X-ray, which can identify defects such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder joints are not detrimental to the reliability of the solder joint).

  • Page 81: Packaging

    The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).
  • Page 82 ME910G1 HW Design Guide 1VV0301593 Rev.3 Page 82 of 97 2020-03-24...

  • Page 83: Reel

    ME910G1 HW Design Guide Reel The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Carrier Tape detail 1VV0301593 Rev.3 Page 83 of 97 2020-03-24...

  • Page 84: Reel Detail

    ME910G1 HW Design Guide Reel detail 1VV0301593 Rev.3 Page 84 of 97 2020-03-24...

  • Page 85: Packaging Detail

    ME910G1 HW Design Guide Packaging detail Moisture sensitivity The ME910G1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).

  • Page 86: Conformity Assessment Issues

    ME910G1 HW Design Guide CONFORMITY ASSESSMENT ISSUES Approvals Type Approval ME910G1-W1 ME910G1-WW EU RED In progress US FCC In progress CA ISED In progress FCC certificates The FCC Certificate is available here: https://www.fcc.gov/oet/ea/fccid IC/ISED certificates The ISED Certificate is available here: https://sms- sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en FCC/ISED Regulatory notices...
  • Page 87 ME910G1 HW Design Guide Wireless notice This device complies with FCC/ISED radiation exposure limits set forth for an uncontrolled environment and meets the FCC radio frequency (RF) Exposure Guidelines and RSS‐102 of the ISED radio frequency (RF) Exposure rules. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
  • Page 88 ME910G1 HW Design Guide Antennas / Antennes This radio transmitter has been approved by FCC and ISED to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
  • Page 89 ME910G1 HW Design Guide Le présent émetteur radio a été approuvé par ISDE pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
  • Page 90 ME910G1 HW Design Guide Label and compliance information FCC The product has a FCC ID label on the device itself. Also, the OEM host end product manufacturer will be informed to display a label referring to the enclosed module The exterior label will read as follows: “Contains Transmitter Module FCC ID: RI7ME910G1W1”...
  • Page 91 ME910G1 HW Design Guide Information on test modes and additional testing requirements The module has been evaluated in mobile stand-alone conditions. For different operational conditions from a stand-alone modular transmitter in a host (multiple, simultaneously transmitting modules or other transmitters in a host), additional testing may be required (collocation, retesting…) If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.
  • Page 92 ME910G1 HW Design Guide Declaration of Conformity Hereby, Telit Communications S.p.A declares that the ME910G1-W1 and ME910G1-W1 Modules are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.telit.com\red Text of 2014/53/EU Directive (RED) can be found here: https://eur-lex.europa.eu/legal-content/EN/TXT/?uri=CELEX:32014L0053...

  • Page 93: Safety Recommendations

    ME910G1 HW Design Guide SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...

  • Page 94: Acronyms

    ME910G1 HW Design Guide ACRONYMS Telit Technical Support Centre TTSC Universal Serial Bus High Speed Data Terminal Equipment Universal Mobile Telecommunication System UMTS Wideband Code Division Multiple Access WCDMA High Speed Downlink Packet Access HSDPA High Speed Uplink Packet Access HSUPA Universal Asynchronous Receiver Transmitter UART...
  • Page 95 ME910G1 HW Design Guide Chip Select Real Time Clock Printed Circuit Board Equivalent Series Resistance Voltage Standing Wave Radio VSWR Vector Network Analyzer 1VV0301593 Rev.3 Page 95 of 97 2020-03-24...

  • Page 96: Document History

    ME910G1 HW Design Guide DOCUMENT HISTORY Revision Date Changes • First issue 2019-04-12 • Bands support updating 2019-08-29 • Added ME910G1-WW • Temperature range update • Added power consumption figures • Removed B14 • Extended Voltange Range lower limit change •...
  • Page 97 Mod. 0805 2016-08 Rev.5...

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