LG -D802 Service Manual page 350

Level LocationNo.
Inductor
6 L2005
Multilayer,Chip
C126
C127 Capacitor
6
C159 Ceramic,Chip
C160
C10039 Capacitor
6
C8008 Ceramic,Chip
6 CN13001 Connector,BtoB
6 R13023 Resistor,Chip
Capacitor
6 C10033
Ceramic,Chip
IC,DC,DC
6 U2000
Converter
Inductor
6 L1089
Multilayer,Chip
VA10009
6 VA10010 Varistor
VA10011
FB202
6 FB203 Filter,Bead
FB204
FL11206 Filter,Separator
6
FL21010 Switch
C2085
L1047
Inductor
6 L1099
Multilayer,Chip
L2008
L2028
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EAP62228101
ECCH0017601
ECZH0000830
ENBY0036001
ERHY0009553
EAE62983901
EAN62867101
EAP62226401
SEVY0005402
SFBH0008102
EAM62792601
EAP62108301
Spec
LG HK 0603 39NJ-T 39NH 5% - 100mA - -
1.72OHM 1.5GHZ 4 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -
55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
GB042-40S-H10-E3000 40P 0.4MM STRAIGHT
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.
MCR006YZPF1004 1MOHM 1% 1/20W 0603 R/TP
- ROHM Semiconductor KOREA CORPORATION
C0402C0G1C330J 33pF -5 to +5% 16V C0G -
55TO+125C 0402 R/TP Max 0.22 L:0.4+-0.02
W:0.2+-0.02 T:0.2+-0.02 TDK KOREA
COOPERATION
QFE1101 V2.2 V2.5 to V4.35 V0.4 to V4.2 0W
WLCSP R/TP 28P WLNSP(2.37x1.97x0.55)
QUALCOMM INCORPORATED.
LQP03TG6N8J02D 6.8NH 5% - 200mA - -
1.15OHM 5.4GHZ 12 SHIELD - 0.6X0.3X0.3MM
R/TP MURATA MANUFACTURING CO.,LTD.
ICVS0505500FR 5.6V 0% 50F 1.0*0.5*0.55 - SMD
R/TP INNOCHIPS TECHNOLOGY
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%
2.2 ohm 0.2A SMD R/TP 2P 0 MURATA
MANUFACTURING CO.,LTD.
XMSSJE3G0PA-003 0.28 33 20 - MURATA
MANUFACTURING CO.,LTD.
LQP03TG8N2J02D 8.2NH 5% - 200mA - - 1.4OHM
4.8GHZ 12 SHIELD - 0.6X0.3X0.3MM R/TP
MURATA MANUFACTURING CO.,LTD.
- 350 - Copyright © 2013 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes