Functions Of Major Semi-Conductors; Hw Features - LG -D802 Service Manual

2.3 Main Parts & Solution
2.3 Main Parts & Solution
2.3 Main Parts & Solution
Item
Item
Digital Baseband
Digital Baseband
Analog Baseband
Analog Baseband
RF Chip
RF Chip

2.4 HW Features

2.4 HW Features
2.4 HW Features
Item
Form Factor
Item
Form Factor
Battery
Battery
Size
Size
Weight
Weight
RX sensitivity
RX sensitivity
TX output power
TX output power
EDGE compatibility
EDGE compatibility
LGE Internal Use Only
LGE Internal Use Only
Part Name
Part Name
MSM8974 : Qualcomm
MSM8974 : Qualcomm
MSM8974 : Qualcomm
MSM8974 : Qualcomm
WTR1605L : Qualcomm
WTR1605L : Qualcomm
Feature
DOP type
Feature
1) Capacity
DOP type
Standard : Li-Ion polymer, 3000mAh
1) Capacity
2) Packing Type : Soft Pack
Standard : Li-Ion polymer, 3000mAh
2) Packing Type : Soft Pack
Standard :
138.5 x 70.9 x 8.9
Standard :
138.5 x 70.9 x 8.9
About 140.5g
WCDMA(FDD1) : -109 dBm
About 140.5g
WCDMA(FDD2) : -108 dBm
WCDMA(FDD1) : -109 dBm
WCDMA(FDD5) : -109 dBm
WCDMA(FDD2) : -108 dBm
WCDMA(FDD8) : -109 dBm
WCDMA(FDD5) : -109 dBm
EGSM : -109 dBm
WCDMA(FDD8) : -109 dBm
GSM850 : -109 dBm
EGSM : -109 dBm
DCS 1800 : -108 dBm
GSM850 : -109 dBm
PCS 1900 : -107 dBm
DCS 1800 : -108 dBm
LTE : - 97dBm
PCS 1900 : -107 dBm
LTE : - 97dBm
WCDMA/
GSM/
WCDMA/
LTE/
GSM/
GPRS
LTE/
GPRS
GPRS Class 12
GPRS Class 12
- 11 -
2. PERFORMANCE
Comment
Comment
Comment
Comment
With Battery
With Battery
WCDMA B1,2,5,8 :
24dBm/3.84MHz,+1/-3dBm
WCDMA B1,2,5,8 :
EGSM : 33dBm
24dBm/3.84MHz,+1/-3dBm
GSM850 : 33dBm
EGSM : 33dBm
DCS1800 : 30dBm
GSM850 : 33dBm
PCS 1900: 30dBm
DCS1800 : 30dBm
LTE B1/B3/B7/B8/B20 :
PCS 1900: 30dBm
23dBm
LTE B1/B3/B7/B8/B20 :
23dBm
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