Sony HCD-DJ2i Service Manual page 32

HCD-DJ2i
Ver. 1.3
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Abbreviation
CND : Canadian model
E3 : 240V AC area in E model
AUS : Australian model
MX : Mexican model
EA : Saudi Arabia model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
HCD-DJ2i
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• 2 : nonfl ammable resistor.
• C : panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti-
critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une piéce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
: Impossible to measure
*
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
f
: TUNER
J
: CD
E
: USB
d
: MIC
• Abbreviation
CND : Canadian model
E3 : 240V AC area in E model
AUS : Australian model
MX : Mexican model
EA : Saudi Arabia model
• Waveforms
– BD93 Board –
IC101 (FEi)
(CD play mode)
Approx.
400 mVp-p
0.2 V/DIV, 500 nsec/DIV
IC101 (TEi)
(CD play mode)
Approx.
500 mVp-p
0.2 V/DIV, 500 nsec/DIV
IC101 (XO)
(CD play mode)
3.2 Vp-p
16.9344 MHz
1 V/DIV, 20 nsec/DIV
IC101 (RFi)
(CD play mode)
1.2 Vp-p
0.5 V/DIV, 500 nsec/DIV
32 32
– MAIN DIGITAL Board – – USB Board –
IC1422 (XT) IC901
2.6 Vp-p
4 MHz
1 V/DIV, 100 nsec/DIV 1 V/DIV, 50 nsec/DIV
IC100 (XC-OUT)
2.3 Vp-p
32.768 kHz
1 V/DIV, 20 μsec/DIV
IC100 (X-OUT)
2.8 Vp-p
5 MHz
1 V/DIV, 100 nsec/DIV
(X2)
3.7 Vp-p
9 MHz