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D-NE730/NE730LS/NE830/NE830LS
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
Note on Printed Wiring Boards.
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• These boards are multi-layer printed board. However, the paterns
of intermediate-layer have not been included in the diagram.
• Waveforms
– MAIN Board –
1
TP604 (RF)
600 mVp-p
200 mV/DIV, 400 ns/DIV
2
IC801 th EXTAL
45.4 ns
1 V/DIV, 20 ns/DIV
12
SECTION 6
DIAGRAMS
1.4 Vp-p
Note on Schematic Diagrams.
• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise specified.
4
•
f
: internal tolerance.
• C : panel designation.
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• Total current is measured with CD installed.
• Power voltage is dc 1.5 V and fed with regulated dc power supply
from battery terminals.
• Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD
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