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Related Manuals for SEPTENTRIO mosaic-X5
Summary of Contents for SEPTENTRIO mosaic-X5
- Page 1 Hardware Manual Version 1.1.0...
- Page 2 Hardware Manual Version 1.1.0 October 28, 2019 © Copyright 2000-2019 Septentrio nv/sa. All rights reserved. Septentrio Greenhill Campus, Interleuvenlaan 15i 3001 Leuven, Belgium http://www.septentrio.com Phone: +32 16 300 800 Fax: +32 16 221 640 @septentrio...
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Page 3: Table Of Contents
1 Table of contents TABLE OF CONTENTS ....................3 MOSAIC-X5 GNSS MODULE ..................6 Overview ........................6 Mechanical ....................... 7 Absolute Maximum Ratings ................... 7 Electrical Characteristics in Operational Conditions .......... 8 2.4.1 Power Supply ......................8 2.4.2 I/O ..........................8 Power Consumption .................... - Page 4 MOSAIC-X5 INTEGRATION ..................22 Minimal Design ...................... 22 Electrical Recommendations ................23 Decoupling......................23 Layout Recommendations ................... 23 4.4.1 Coplanarity ......................23 4.4.2 Power ........................23 4.4.3 Antenna Input ....................... 24 4.4.4 Avoiding Self-Interference..................24 PRODUCT HANDLING ....................26 ESD Precautions ..................... 26 Packaging .......................
- Page 5 APPENDIX B SYSTEM NOISE FIGURE AND C/N0 ............37 APPENDIX C EMC CONSIDERATIONS ................38...
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Page 6: Mosaic-X5 Gnss Module
GNSS Module 2 mosaic-X5 GNSS Module 2.1 Overview Septentrio mosaic-X5 is a low-power multi-band multi-constellation GNSS receiver packaged in a 31x31mm LGA module. The internal block diagram is shown below. The module operates from a single 3V3 power supply (VDD_3V3). -
Page 7: Mechanical
GNSS Module SDCard interface for logging to an external SD-Card. See section 3.6. • GPIO and LEDs output. See section 3.10. • 2.2 Mechanical All dimensions in millimeters. Weight = 6.8g LGA Details Specification Land pitch 1.27 mm Land diameter 0.6 mm... -
Page 8: Electrical Characteristics In Operational Conditions
GNSS Module 3V3_LVTTL input pin voltage -0.3 VDD_3V3+0.3 EVENT input voltage See 3.8 -0.3 1V8_OUT+0.3 RF input power See 3.2 REF_I level See 3.7 Vp-p Output pins drive current 2.4 Electrical Characteristics in Operational Conditions 2.4.1 Power Supply Parameter... -
Page 9: Power Consumption
GNSS Module 2.5 Power Consumption The module is powered through the VDD_3V3 pins, see section 3.1. The power consumption depends on the set of GNSS signals enabled and on the positioning mode. The following table lists the power consumption for some configurations, while tracking all satellites in view from an open sky, and with the module at room temperature. -
Page 10: Pinout And I/O Description
Pinout and I/O Description 3 Pinout and I/O Description The module provides 239 LGA pads, configured as follows. TOP VIEW The following sections describe all the non-reserved pads. Pads are grouped by functions. Conventions: Pin Type: I=Input, O=Output, P=Power, Ctrl=Control, Clk=Reference clock •... -
Page 11: Power Supply
Pinout and I/O Description 3.1 Power Supply The module is powered through the VDD_3V3 pins. Pin Name Type Level Description Comment VDD_3V3 3.3V +/-5% Main power supply input All VDD_3V3 pins must be tied together. Ground All GND pins must be connected to ground. -
Page 12: Electrical Specifications
Pinout and I/O Description 3.2.1 Electrical Specifications Equivalent DC series impedance at 2.5 Ohms typical, 3.0 Ohms max the ANT pin Antenna current limit 150 mA Antenna net gain range 15-50 dB Receiver noise figure 8.5 dB with 15 dB net pre-amplification (NFrx, see Appendix B) 18 dB with 25 dB net pre-amplification 26 dB with 35 dB net pre-amplification... -
Page 13: Com Ports
An example of a circuit to convert the COM1 signals to RS232 level is shown below. In green, the signals to be connected to the mosaic-X5 pins. The RTS1 and CTS1 signals can be left unconnected if hardware flow control is not required. -
Page 14: Usb Device Interface
Pinout and I/O Description 3.4 USB Device Interface The following pins are used for accessing the module over USB in USB-device mode. Pin Name Type Level Description Comment USB_VBUS1 4.40V to USB VBUS input. 5.5V This pin cannot be used to power the module. Maximal current drawn by the module is 50 mA. -
Page 15: Sd Memory Card
Pinout and I/O Description The PHY compatible with the module is the KSZ8041NLI PHY from Microchip. An application circuit using this PHY and a Würth 74990111217 RJ45 connector with integrated magnetics is given below. In green, the signals to be connected to the mosaic- X5 pins. - Page 16 Pinout and I/O Description Driving the LOGBUTTON pin low for 100 ms to 5 seconds toggles logging on and off. Driving the LOGBUTTON pin low for more than 5 seconds and then releasing it unmounts the SD card if it was mounted, or mounts it if it was unmounted. The SD card mount status can be checked with the LOGLED pin (see Appendix A).
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Page 17: Clock Frequency Reference
Pinout and I/O Description 3.7 Clock Frequency Reference The module can use its internal TCXO frequency reference, or can accept an external frequency reference, bypassing the internal TCXO. Pin Name Type Level Description Comment REF_I 0.5-1.7Vp-p Main frequency reference input, DC-decoupled, input capacitance See section 3.7.2. -
Page 18: Event/Timesync Inputs
TimeSync source using the setTimeSyncSource command. When an event pin is configured as TimeSync source, the mosaic-X5 expects to see a one-pulse-per-second (1PPS) signal on that pin. It will then synchronize its internal time base (i.e. the time at which GNSS measurements are sampled) to that 1PPS signal. TimeSync is typically used in conjunction with ExtFreq (see section 3.7.2) to fully synchronize the module internal... -
Page 19: Pps Output
Pinout and I/O Description They could as well be created via a level shifter, using the 1V8_OUT output from the module to supply the module side. 3.9 PPS output Pin Name Type Level Description Comment PPSO 1V8_LVTTL PPS output. Max output current: 10 mA. Polarity and rate user selectable. -
Page 20: Leds
Pinout and I/O Description During the first seconds after powering up the module, these pins are in tristate. Use an external pull-down or pull-up resistor to have the desired level during boot. The GPx pins can drive a maximum current of 10mA. 3.11 LEDs The LED pins can be used to monitor the module status. - Page 21 Pinout and I/O Description An example circuit with an external power switch and an on/off push-button is shown below. The module can be put in standby by either: Entering the exePowerMode, standby user command; • Driving the ONOFF pin low for at least 50ms (i.e. pressing the button for at least •...
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Page 22: Mosaic-X5 Integration
Integration 4 mosaic-X5 Integration 4.1 Minimal Design A minimal design, exposing only a single serial port (COM1-TTL) is shown below. In this example: All gound pins and the pins marked “Reserved_GND” are connected to ground • (GND). A 3.3VDC supply is provided to the VDD_3V3 pins and to the VDD_BAT pin. A 22µF •... -
Page 23: Electrical Recommendations
Make sure layers opposite from the center of the board have a similar amount of • copper (copper-balancing). Avoid iron-based soldered shielding cans in the proximity of mosaic-x5 • If the motherboard thickness is 1.2 mm or less, it needs to be supported during •... -
Page 24: Antenna Input
The antenna trace can be directly routed to the desired type of coax connector, as all protection circuitry is integrated in mosaic-x5. 4.4.4 Avoiding Self-Interference The antenna input connection is sensitive to interference from higher harmonics of other signals on the board. - Page 25 Integration The SDIO, RMII and MDIO signals of mosaic-x5 can cause harmful radiated • interference if not properly routed. In designs with a collocated antenna, these signals shall preferably be routed in an inner layer of the board, shielded by ground planes or a ground copper pour at top and bottom layers, connected with stitching vias.
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Page 26: Product Handling
Product Handling 5 Product Handling 5.1 ESD Precautions Electrostatic discharge is a sudden flow of current from one object to another either object or to ground. Electrostatic charges can accumulate on common items such as polystyrene drinking cups, cellophane tape, synthetic clothing, untreated foam packaging material, and untreated plastic bags and work folders, to name but a few. -
Page 27: Packaging
Septentrio receivers and modules are compliant with the latest WEEE, RoHS and REACH directives. For more info see www.septentrio.com/en/environmental-compliance. 5.2 Packaging The mosaic-X5 modules are delivered on JEDEC CO-029AN 9x3 matrix trays, with 27 modules per tray. 5.3 Part Number Mosaic-X5 ordering code: 410322 5.4 Moisture Sensitivity... - Page 28 Product Handling When implemented on a double-sided PCB, it should be made sure that the board side on which mosaic-X5 is assembled is reflowed last. Don’t use glue to attach the component, as this might lift the component and jeopardize bonding.
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Page 29: Development Kit
USB Host 3&4 REF IN The mosaic-X5 Development Kit is composed of the mosaic-X5 module soldered on an interface PCB (GTB-0051), itself plugged on the DevKit board (DEV-0043). The above picture shows the DevKit board without the mosaic-X5. DevKit Part Number: 410331P3161 (including antenna and accessories). -
Page 30: Antenna Connectors
Make sure that a jumper is placed on header J200, as shown below. Otherwise the DevKit will be powered, but not the mosaic-X5 module. To measure the power consumption of the mosaic-X5 module (excluding the contribution from the DevKit and the antenna, but including a small contribution from the interface board, remove the jumper on J200 and connect the two pins to the probes of a multimeter in current-sensing mode. -
Page 31: Leds And General Purpose Output Pins
COM 2 COM 4 By default, the four COM ports of the mosaic-X5 module are routed to the four DB9 connectors of the DevKit. Electrical levels on the BD9 conform to the RS232 standard. RTS/CTS lines are supported only on COM2 and COM3 (the mosaic-X5 has RTS/CTS lines on COM1 as well, but they are not routed to the DevKit). -
Page 32: Pps Out And Event Inputs
EVENTB EVENTA The PPSout pin of header J500 is connected to the PPSOUT pin of the mosaic-X5 module through a 1.8V to 3.3V level shifter. The PPS level at the header is 3.3V. The EVENTA and EVENTB pins of J500 are connected to the EventA and EventB pins of the mosaic-X5 through a level shifter to 1.8V. -
Page 33: Ethernet
Development Kit 6.6 Ethernet The DevKit supports 10/100 Base-T Ethernet. It is not possible to power the DevKit through the Ethernet connector. 6.7 USB Dev That connector can be attached to a PC to power the DevKit and to communicate with the module over its USB port. -
Page 34: Sd Card Socket
Development Kit Pressing the nRST button drives the nRST pin of the mosaic-X5 low, which resets the module. Pressing the LOGGING button drives the LOGBUTTON pin of the mosaic-X5 low. This can be used to enabled and disable logging, as described in section 3.6. -
Page 35: Appendix Aled Status Indicators
LED Status Indicators Appendix A LED Status Indicators The LED pins can be used to monitor the module status. They can be used to drive external LEDs. It is assumed that the LED lights when the electrical level of the corresponding pin is high. - Page 36 LED Status Indicators The LOGLED reports the SD card mount status and logging activity. LED Behaviour LOGLED LED is off when the SD card is not present or not mounted. LED is on when the SD card is present and mounted. Short blinks indicate logging activity.
- Page 37 System Noise Figure and C/N0 Appendix B System Noise Figure and C/N0 The system noise figure, in dB, can be calculated as: NFsys = 10*log NFant/10 + (10 NFrx/10 -1)/10 Gpreamp/10 where NFant is the antenna LNA noise figure, in dB; •...
- Page 38 EMC Considerations Appendix C EMC Considerations In applications in which the electronics are collocated with the GNSS antenna, cross-talk could be a major concern. GNSS signals are very weak and easily interfered by radiated harmonics of digital signals. The most useful indicator of the signal reception quality is the C/N0 of the satellites in view.
- Page 39 EMC Considerations An example of interference is shown below. This particular interference at about 1598 MHz falls in the GLONASS L1 band and slightly degrades the L1 C/N0 of some GLONASS satellites. Try to keep personal computers and other equipment more than 2 meters away from the antenna while assessing electromagnetic compatibility of the integration.
- Page 40 (see the setNotchFiltering command). Intermittent wide-band cross-talk can often be eliminated with the wide band interference canceller (see the setWBIMitigation command). The mosaic-X5 module has been designed to minimize radiation and can be used close to an antenna without additional shielding.
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