Sony XDR-S10HDiP Service Manual page 14

XDR-S10HDiP
• Circuit Boards Location
FAN CONNECTING board
KEY (MAIN) board
POWER board
MICON board
XDR-S10HDiP
IP DOCK board
KEY (TAG) board
MAIN board
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THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : internal component.
f
• : Pattern from the side which enables seeing.
• Indication of transistor.
C
These are omitted.
B E
• Waveforms
– MICON Board –
IC401 (XCOUT)
2.4 Vp-p
32.0 kHz
1 V/DIV, 10 μs/DIV
IC401 (XOUT)
3.2 Vp-p
5.53 MHz
1 V/DIV, 0.1 μs/DIV
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For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : FM
f : AM
: iPod
J
L : AUDIO IN