Haier HT-3718 Service Manual page 5

maintain tip temperature within the range of 500
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or 1.25cm)
brush with a metal handle. Do not use freon-propelled spay-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.(500
b. Heating the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-type solder removal device
with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.(500
b. First, hold the soldering iron tip and solder the strand against the component lead until the
solder melts.
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F to 600
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F to 600 F)
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F to 600 F )